H04N23/54

LENS MODULE AND MANUFACTURING METHOD THEREOF
20230051039 · 2023-02-16 ·

A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

APPARATUS FOR FASTENING AN IMAGING DEVICE AT A PREDETERMINED ARRANGEMENT FOR IMAGE CAPTURE AND DETECTING REGIONS OF INTEREST IN AN IMAGE USING IMAGE PROCESSING

An apparatus includes a base; a mount attached to the base, the mount including a backplate, a bottom platform formed perpendicular to the backplate along a bottom of the backplate, the bottom platform including a retention wall formed as part of the bottom platform distant from the portion of the bottom platform attached to the backplate, the retention wall being perpendicular to the bottom platform, and a first side arm formed as part of the backplate along a side of the backplate and extending outwards from the backplate, and a notch holder formed as part of the base, the notch holder configured to secure a drug test device to the base.

APPARATUS FOR FASTENING AN IMAGING DEVICE AT A PREDETERMINED ARRANGEMENT FOR IMAGE CAPTURE AND DETECTING REGIONS OF INTEREST IN AN IMAGE USING IMAGE PROCESSING

An apparatus includes a base; a mount attached to the base, the mount including a backplate, a bottom platform formed perpendicular to the backplate along a bottom of the backplate, the bottom platform including a retention wall formed as part of the bottom platform distant from the portion of the bottom platform attached to the backplate, the retention wall being perpendicular to the bottom platform, and a first side arm formed as part of the backplate along a side of the backplate and extending outwards from the backplate, and a notch holder formed as part of the base, the notch holder configured to secure a drug test device to the base.

VEHICULAR CAMERA DEVICE

In a vehicle camera device, a camera is housed inside a bracket of a base, and a stud bolt of the base is connected to a side door. Heat generated by the camera is transferred to the side door via the bracket, the base, and the stud bolt. Therefore, the heat generated by the camera can be efficiently released from the camera.

ELECTRONIC DEVICE AND ELECTRONIC SYSTEM

An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.

OPTICAL DEVICE
20230048279 · 2023-02-16 · ·

An optical element is provided. The optical device includes a carrier, a first receiver, and a second receiver. The first receiver is disposed on the carrier and configured to receive a first light. The second receiver is disposed on the carrier and configured to receive a second light. The first light and the second light have different frequency bands.

OPTICAL SPRAY PATTERN IMAGING APPARATUS INCLUDING PERMANENTLY INTEGRATED LIGHT PLANE AND IMAGE CAPTURE COMPONENTS
20230051971 · 2023-02-16 ·

A pre-calibrated spray plane image acquisition device is described that includes, in a single fixed-form structure, both an image capture component configured to acquire an optical image of a field of view and a light plane generator configured to generate a planar light plane emitted from the pre-calibrated spray plane image acquisition device. A carrier frame structure includes rigid components for permanently maintaining the image capture component and the light plane generator in respective positions defining a permanent spatial relationship between the field of view of the image capture component and the light plane generated by the light plane generator.

DISPLAY CAMERA ASSEMBLY
20230046711 · 2023-02-16 ·

A system can include a display assembly that includes a display, a display side, a back side and a frame, where the back side includes a serial bus socket; and a camera assembly that includes a camera head unit coupled to an end of an arm, where an opposing end of the arm includes a serial bus connector receivable by the serial bus socket of the back side of the display assembly.

DISPLAY CAMERA ASSEMBLY
20230046711 · 2023-02-16 ·

A system can include a display assembly that includes a display, a display side, a back side and a frame, where the back side includes a serial bus socket; and a camera assembly that includes a camera head unit coupled to an end of an arm, where an opposing end of the arm includes a serial bus connector receivable by the serial bus socket of the back side of the display assembly.

IMAGE CAPTURING MODULE, ENDOSCOPE AND METHOD OF MANUFACTURING IMAGE CAPTURING MODULE

An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.