A radiation detector includes control and data lines extending respectively in mutually-orthogonal first and second directions, photoelectric conversion parts respectively in regions defined by the control and data lines, noise detecting parts outside a region including the photoelectric conversion parts, a control circuit inputting control signals to first and second thin film transistors located respectively in the photoelectric conversion and noise detecting parts, a signal detection circuit reading image data and noise signals respectively from the photoelectric conversion and noise detecting parts, and an image configuration circuit configuring a radiation image based on the signals that are read. The signals from the photoelectric conversion parts adjacent to the noise detecting parts are not read and/or are not used by the image configuration circuit when configuring the radiation image, and/or the photoelectric conversion parts adjacent to the noise detecting parts are not electrically connected with the control and/or signal detection circuits.

A radiation detector includes control and data lines extending respectively in mutually-orthogonal first and second directions, photoelectric conversion parts respectively in regions defined by the control and data lines, noise detecting parts outside a region including the photoelectric conversion parts, a control circuit inputting control signals to first and second thin film transistors located respectively in the photoelectric conversion and noise detecting parts, a signal detection circuit reading image data and noise signals respectively from the photoelectric conversion and noise detecting parts, and an image configuration circuit configuring a radiation image based on the signals that are read. The signals from the photoelectric conversion parts adjacent to the noise detecting parts are not read and/or are not used by the image configuration circuit when configuring the radiation image, and/or the photoelectric conversion parts adjacent to the noise detecting parts are not electrically connected with the control and/or signal detection circuits.

Some embodiments include a system, comprising: a plurality of pixels; a plurality of data lines coupled to the pixels; a plurality of switches coupling the pixels to the data lines; a plurality of readout circuits coupled to the data lines; control logic coupled to the readout circuits, the control logic configured to, for one of the pixels: acquire a first value for the pixel while the corresponding switch is in an off state; reset the corresponding readout circuit corresponding for the pixel; acquire a second value for the pixel after resetting the readout circuit; turn on the corresponding switch; acquire a third value for the pixel after turning on the corresponding switch; and combine the first value, the second value, and the third value into a combined value for the pixel.

A plurality of control lines extending in a first direction, a plurality of data lines that extend in a second direction crossing the first direction, a photoelectric converter that includes a photoelectric conversion element and is electrically connected to a corresponding control line and a corresponding data line, a scintillator provided on a plurality of the photoelectric converters, a bias line electrically connected to a plurality of the photoelectric conversion elements, a voltage generation circuit electrically connected to the bias line, and a radiation incidence determination circuit that is electrically connected to the bias line and detects a change of a voltage occurring at an incidence start of radiation are included.

An image detector includes a substrate, a circuit layer, a plurality of light detecting elements, a plurality of driving elements and a crystal scintillation layer. The substrate has a surface. The circuit layer is arranged on the surface of the substrate, and defines a plurality of detecting areas arranged in an array. The light detecting elements and the driving elements are disposed at the detecting areas and electrically connected with the circuit layer. Each driving element drives one or more of the light detecting elements. The crystal scintillation layer is arranged opposite to the substrate and covers the detecting areas. The light detecting elements and the driving elements connect with the surface of the substrate. At least one of the light detecting elements and the driving elements is formed by a process different from the process of forming the circuit layer on the substrate.

A radiation imaging apparatus includes a detection unit configured to detect radiation emitted from a radiation irradiation unit, the apparatus comprises a processing unit configured to obtain dose distribution information regarding the radiation with which the detection unit is irradiated from the radiation irradiation unit. The processing unit corrects, using the dose distribution information, an image signal output from the detection unit.

A radiation imaging apparatus includes a detection unit configured to detect radiation emitted from a radiation irradiation unit, the apparatus comprises a processing unit configured to obtain dose distribution information regarding the radiation with which the detection unit is irradiated from the radiation irradiation unit. The processing unit corrects, using the dose distribution information, an image signal output from the detection unit.

A radiation imaging apparatus comprises a plurality of pixels arranged in a matrix pattern, each pixel including a signal generation portion configured to generate a signal based on accumulated charges and a holding portion configured to hold a signal output from the signal generation portion, a switch configured to commonly connect a predetermined number of pixels of the plurality of pixels to add the signals from the predetermined number of pixels, and a readout circuit configured to read out accumulation signals held in the holding portion over a plurality of times while changing an addition region by using the switch and performing pixel addition and obtain a plurality of images different in pixel addition count with respect to one time of charge accumulation.

Techniques are provided for x-ray sensing for intraoral tomography. A methodology implementing the techniques according to an embodiment includes detecting an x-ray pulse based on energy received at one or more pixels of a pixel array. The method also includes integrating the energy received at each of the pixels of the array of pixels, in response to the detection, wherein the energy received at each of the pixels is associated with the x-ray pulse. The method further includes multiplexing readouts of analog signals from the array of pixels into two or more parallel channels. The method further includes simultaneously converting (or otherwise in parallel) the analog signals of each of the channels into digital signals and storing the digital signals in memory as frames of data. The method may further include, for example, transmitting the frames of data from the memory, over a Universal Serial Bus, to an imaging system.

Techniques for acquiring an electron energy loss spectrum in two dimensions are disclosed herein. The technique at least includes exposing an electron sensor to an electron spectrum projected in two dimensions, wherein one of the two dimensions corresponds to a dispersive axis, and the other of the two dimensions corresponds to a non-dispersive axis, receiving an electron sensor readout frame from the electron sensor, where the electron sensor readout frame comprises a plurality of values representative of the electron spectrum in each of the two dimensions, and reducing a resolution of the electron sensor readout frame in at least one of the two dimensions, where reducing the resolution includes reducing the number of values in the at least one of the two dimensions, where the electron sensor readout frame comprises a plurality of values in each of the two dimensions after the reduction in resolution.