An imaging device has a lens holding member; a base member for holding the lens holding member; and a substrate to which the base member is secured. The lens holding member holds at least one lens. The base member has a contact surface that is perpendicular to an optical axis of the lens, and contacts an end face of the lens holding member in a state wherein the lens holding member is held; and an opening portion through which passes the optical axis of the lens, provided in the contact surface. The substrate has an imaging element on which light that has passed through the lens and through the opening portion of the base member is incident.

A thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.

A lens driving mechanism is provided, including a lens holder, a circuit unit, a driving element, and an integrated circuit element. The lens holder is used for holding a lens. The circuit unit is disposed on a side of the lens holder. The driving element is used for driving the lens holder to move relative to the circuit unit. The integrated circuit element is electrically connected to the driving element and disposed on the circuit unit. The driving element is disposed between the lens holder and the integrated circuit element.

An image capturing apparatus includes an image sensor, a frame configured to support the image sensor, and one or more driving members configured to move the frame in a direction parallel with an imaging plane of the image sensor. The driving members include a vibration unit that generates vibration. The vibration unit of at least one of the driving members overlaps a center of the imaging plane of the image sensor, when viewed in a direction orthogonal to the imaging plane of the image sensor.

There is provided a solid state imaging device. A rib is arranged on a frame part to be joined to a board on which an image sensor is mounted, the rib abutting on the board at an abutting position next to a periphery of the image sensor.

An image capturing apparatus includes an image sensor, a frame configured to support the image sensor, and one or more driving members configured to move the frame in a direction parallel with an imaging plane of the image sensor. The driving members include a vibration unit that generates vibration. The vibration unit of at least one of the driving members overlaps a center of the imaging plane of the image sensor, when viewed in a direction orthogonal to the imaging plane of the image sensor.

A lens driving mechanism is provided, including a lens holder, a circuit unit, a driving element, and an integrated circuit element. The lens holder is used for holding a lens. The circuit unit is disposed on a side of the lens holder. The driving element is used for driving the lens holder to move relative to the circuit unit. The integrated circuit element is electrically connected to the driving element and disposed on the circuit unit. The driving element is disposed between the lens holder and the integrated circuit element.

A camera module includes an imaging function section, a connector forming section, and a connecting section combined in a laminated body. The connecting section is thinner than the imaging function section and is bendable. The imaging function section includes a cavity and a through hole. An image sensor IC is disposed within the cavity. A lens unit is mounted in the imaging function section to be optically coupled to the image sensor IC via the through hole. A light shielding member covers a boundary between the connecting section and the imaging function section that define a height difference.