There is provided a casing, adapted to a board having a first air vent and a second air vent, including: a base plate; a first side plate and a second side plate provided on a first side and a second side of the base plate, respectively, with both the first side plate and the second side plate having hollowed-out patterns, and after the board being fixed in the casing, the first side plate being opposite to the first air vent, and the second side plate being opposite to the second air vent; a connection backplate on a fourth side of the base plate; and at least one insert plate on the base plate, with an extension direction in which the insert plate extends intersecting with an extension direction in which a third side of the base plate extends. An electronic device including the casing described above is further provided.

Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.

A thermal management system for a power and fiber splice enclosure that includes a housing including electrical components is provided. The thermal management system includes a solar shield disposed external to the housing and covering at least a major portion of the housing. The thermal management system includes a vent disposed in the housing for venting hot air from the enclosure. The thermal management system includes a condenser thermally coupled to a heat conducting component of the enclosure for cooling at least the heat conducting component.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.

The invention relates to a switch cabinet arrangement with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger comprises a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device comprises a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected. A corresponding method is further described.

A thermal management system for a power and fiber splice enclosure that includes a housing including electrical components is provided. The thermal management system includes a solar shield disposed external to the housing and covering at least a major portion of the housing. The thermal management system includes a vent disposed in the housing for venting hot air from the enclosure. The thermal management system includes a condenser thermally coupled to a heat conducting component of the enclosure for cooling at least the heat conducting component

A heat exchanger includes a vapor collection pipe, a liquid collection pipe, and an exchange pipeline. The exchange pipeline includes a condensing section, an evaporation section, and a transition section. An upper end of the condensing section is connected to the vapor collection pipe. A lower end of the condensing section is connected to a first end of the transition section. An upper end of the evaporation section is connected to a second end of the transition section. A lower end of the evaporation section is connected to the liquid collection pipe. The evaporation section and the condensing section respectively extend in directions opposite to each other.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”), one or more circuits mounted to the PCB and a faceplate. The faceplate includes a middle plate, a first side plate, and a second side plate. The first side plate extends from the middle plate at an obtuse angle relative to the middle plate towards a first side and back of the module. The second side plate extends from the middle plate, opposite to the first side plate, at an obtuse angle relative to the middle plate towards a second side and the back of the module.

A telecommunications system is disclosed herein. The telecommunications system includes a chassis defining a top end, a bottom end, and a generally pyramidal shape, wherein a transverse cross-sectional footprint of the chassis changes in outer dimension as the transverse cross-sectional footprint extends from the top end to the bottom end, the telecommunications chassis further defining at least one sidewall, the at least one sidewall extending at an angle to both the top end and the bottom end, the at least one sidewall defining ports defining connection locations for receiving telecommunications equipment.

The electronic device includes a housing that surrounds one or more components of the device and has front, back, top and bottom sides. At least one port is located on at least one of the front and back sides of the housing and configured to receive an end plug of a network cable and communicatively coupled to the one or more components. The housing includes at least one opening formed on at least one of the front and back sides, where the opening is configured to allow the network cable to pass therethrough. At least one side of the housing defines a space so as to allow the network cable to travel between the front side to the back side through the opening and the space.