An electronic device according to various embodiments disclosed herein may include: a housing, a camera module comprising a camera disposed in the housing, a speaker module comprising a speaker positioned in a first direction with respect to the camera module, a receiver module comprising a receiver positioned in a second direction opposite to the first direction with respect to the camera module, first sound holes including a connection hole positioned in the first direction with respect to the camera module and a hole positioned in the second direction with respect to the camera module, the first sound holes being positioned on a side surface of the electronic device, a first sound conduit interconnecting the connection hole and the speaker module, a second sound hole positioned on a front surface of the electronic device, a second sound conduit including a connection conduit disposed in a third direction perpendicular to the first direction with respect to the first sound conduit, the second sound conduit interconnecting the second sound hole and the receiver module, and a connection portion interconnecting the first sound conduit and the connection conduit of the second sound conduit.

A loudspeaker includes a support, a magnetic assembly, a first vibration assembly, and a second vibration assembly. The first vibration assembly and the second vibration assembly are respectively arranged on a first side and a second side opposite to the first side of the support; the first vibration assembly includes a first voice coil and a first vibration diaphragm, the second vibration assembly includes a second voice coil and a second vibration diaphragm, the first vibration diaphragm and the second vibration diaphragm are both connected to the support; and the support is provided with an accommodating space for arranging the magnetic assembly, a magnetic gap is formed between the magnetic assembly and the support, the first voice coil and the second voice coil are both at least partially located in the magnetic gap, the first vibration assembly and the second vibration assembly emit ultrasonic waves having different frequencies.

A loudspeaker includes a support, a magnetic assembly, a first vibration assembly, and a second vibration assembly. The first vibration assembly and the second vibration assembly are respectively arranged on a first side and a second side opposite to the first side of the support; the first vibration assembly includes a first voice coil and a first vibration diaphragm, the second vibration assembly includes a second voice coil and a second vibration diaphragm, the first vibration diaphragm and the second vibration diaphragm are both connected to the support; and the support is provided with an accommodating space for arranging the magnetic assembly, a magnetic gap is formed between the magnetic assembly and the support, the first voice coil and the second voice coil are both at least partially located in the magnetic gap, the first vibration assembly and the second vibration assembly emit ultrasonic waves having different frequencies.

A loudspeaker enclosure comprising a plurality of acoustic sources and having controlled broad-band directivity.

A loudspeaker enclosure comprising a plurality of acoustic sources and having controlled broad-band directivity.

An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

A waveguide housing for a speaker assembly. The speaker assembly includes first and second drivers coupled to the waveguide housing where the first driver generates a midrange sound signal and the second driver emits a high-frequency sound signal. The waveguide housing includes a first plurality of sound channels configured to receive the midrange sound signal from the first driver such that the midrange sound signal travels through the first plurality of sound channels and is emitted from the waveguide housing by a first plurality of openings in the waveguide housing. The waveguide housing also includes a second plurality of sound channels configured to receive the high-frequency sound signal from the second driver such that the high-frequency sound signal travels through the second plurality of sound channels and is emitted from the waveguide housing by a second plurality of openings in the waveguide housing.

A waveguide housing for a speaker assembly. The speaker assembly includes first and second drivers coupled to the waveguide housing where the first driver generates a midrange sound signal and the second driver emits a high-frequency sound signal. The waveguide housing includes a first plurality of sound channels configured to receive the midrange sound signal from the first driver such that the midrange sound signal travels through the first plurality of sound channels and is emitted from the waveguide housing by a first plurality of openings in the waveguide housing. The waveguide housing also includes a second plurality of sound channels configured to receive the high-frequency sound signal from the second driver such that the high-frequency sound signal travels through the second plurality of sound channels and is emitted from the waveguide housing by a second plurality of openings in the waveguide housing.

An apparatus may include an ultrasonic sensor system having a first layer stack and a second layer stack. The first layer stack may include a first ultrasonic transmitter and the second layer stack may include a second ultrasonic transmitter. The first layer stack and/or the second layer stack may include an ultrasonic receiver. A frequency splitting layer may reside between the first layer stack and the second layer stack.