An earphone according to the present disclosure includes: a speaker unit that generates a sound wave; a case having one end and the other end opposite to the one end and housing the speaker unit; and a sound conduit connected to the one end side of the case and provided with a sound hole that emits the sound wave generated from the speaker unit, in which an internal space connected to the sound hole is provided between the speaker unit and the sound conduit in the case, and the case is provided with a plurality of vent holes that communicate the internal space with an external space that is outside the case.

An electronic device is provided. The electronic device includes a first frame including a first surface, a second surface facing the direction opposite to that of the first surface, and a side surface encompassing the space between the first surface and the second surface, a guide path which is formed in the space of the first frame and which includes, from the side surface toward the space, an external environment connection hole formed at a specified depth, a first through-hole formed from the second surface up to the external environment connection hole, and a second through-hole formed at a location apart from the first through-hole so as to be formed from the first surface up to the second surface, and a sealing member including a sound module disposed on the first surface so as to correspond to the second through-hole, and a recess which is disposed on the second surface and connects the first through-hole to the second through-hole.

A loudspeaker enclosure comprising a plurality of acoustic sources and having controlled broad-band directivity.

A speaker and an electronic device are provided. The speaker includes a counterweight body, and a lower shell, a middle shell, an electric vibration plate, and a dome where the lower shell, the middle shell, and the electric vibration plate are matched to form an accommodating cavity, and the counterweight body is disposed in the accommodating cavity and is connected to a first surface of the electric vibration plate; the dome is disposed on a second surface of the electric vibration plate away from the counterweight body; and when a voltage is applied to the electric vibration plate, the electric vibration plate drives the dome to move.

The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.

Supercoupling waveguides are provided in which acoustic impedance at an acoustic input port matches the acoustic impedance at an acoustic output port, where the acoustic path extending from the acoustic input port to the acoustic output port has a variable length. The supercoupling waveguides may be used in methods of sensing and measuring, and may be incorporated into sensors.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A waveguide housing for a speaker assembly. The speaker assembly includes first and second drivers coupled to the waveguide housing where the first driver generates a midrange sound signal and the second driver emits a high-frequency sound signal. The waveguide housing includes a first plurality of sound channels configured to receive the midrange sound signal from the first driver such that the midrange sound signal travels through the first plurality of sound channels and is emitted from the waveguide housing by a first plurality of openings in the waveguide housing. The waveguide housing also includes a second plurality of sound channels configured to receive the high-frequency sound signal from the second driver such that the high-frequency sound signal travels through the second plurality of sound channels and is emitted from the waveguide housing by a second plurality of openings in the waveguide housing.