A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.

The microphone device includes a tubular support of a conductive material. A microphone unit is provided at one end of the support and grounded to the support. A cable passes through the support and includes core wires connected to a signal output terminal of the microphone unit. A conductive covering material that covers the core wires and is electrically connected to the support.

A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.

A MEMS microphone integrates a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. The system also permits for a method for easily switching between these two modes and for outputting both digital output signals at the same common output pad, which allows for the use of the footprint of a conventional microphone.

A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.

A variable voltage phantom power supply assembly includes a phantom power supply unit having a power input, and one or more audio channels. The variable voltage phantom power supply assembly also includes a variable voltage phantom power supply module having a phantom power supply circuit with a variable voltage controller and a variable voltage phantom power output. A method of customizing at least one performance characteristic of a microphone includes: modifying a phantom power supply to provide a variable voltage phantom power output; connecting a microphone to an input of a variable voltage phantom power supply assembly; adjusting the voltage output of the variable voltage phantom power supply to the microphone; monitoring the performance characteristics of the microphone; and, readjusting the voltage output of the variable voltage phantom power supply to the microphone to obtain at least one desired performance characteristic of the microphone.

The present disclosure provides a vibration sensor including a vibration assembly including a mass element and an elastic element, a first acoustic chamber, an acoustic transducer, and a buffer member. In response to an external vibration signal, the vibration assembly vibrates such that a volume of the first acoustic chamber changes. The acoustic transducer is in communication with the first acoustic chamber. In response to a volume change of the first acoustic chamber, the acoustic transducer may generate an electrical signal. The buffer member is connected to the mass element or the elastic element. The buffer member reduces an impact force of the mass element acting on the elastic element during a vibration process of the vibration assembly. The acoustic transducer has a first resonance frequency, the vibration assembly has a second resonance frequency, and the second resonance frequency is less than the first resonance frequency.

A moving robot may include a main body which forms a space therein, an inner housing which surrounds the main body, an outer housing, two voice recognition members/devices (or voice sensors) which are disposed in the housings and are disposed to be separated from each other, and a microphone mount which is supported by the inner housing and causes the voice recognition device to be in close contact with the outer housing. The microphone mount may include a bending prevention rib which is disposed below the microphone mount to prevent bending of the microphone mount, and a twist prevention rib which is disposed below the microphone mount to prevent twisting of the microphone mount.