This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

A display device includes: a display panel including a first substrate and a light emitting element layer disposed on the first substrate; and a sound generator disposed on one surface of the first substrate, where the sound generator vibrates the display panel to output a sound. The sound generator includes: a first vibration generator which vibrates the display panel by generating a magnetic force using a first voice coil therein; and a second vibration generator including a vibration layer which contracts or expands based on a voltage applied thereto to vibrate the display panel, where the first vibration generator and the second vibration generator overlap each other in a thickness direction of the display panel.

A sound-producing structure includes: a hollow piece; a sound-producing piece located in a hollow cavity of the hollow piece; and a heat dissipation piece located outside the hollow cavity, a first part of the heat dissipation piece being located below the hollow piece and a second part of the heat dissipation piece being on a side wall of the hollow piece.

This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.

This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.

Provided is a sound-absorbing material, including an adsorbent material and a thermal conductive material. The thermal conductive material is uniformly dispersed in the sound-absorbing material. The thermal conductive material includes a carbon fiber material, and a weight ratio of the carbon fiber material in the sound-absorbing material is within a range of 0.05% to 10%. Further provided are a preparation method of the sound-absorbing material and a speaker using the sound-absorbing material. The sound-absorbing material has higher thermal conductivity and can be added to a rear cavity of the speaker to effectively conduct heat generated when the speaker is working, thereby improving the heat dissipation performance of the speaker.

Aspects of the subject technology relate to electronic devices having speakers and airflow sensors for the speakers. In one or more implementations, the airflow sensor may be formed, in part, by a mesh structure that spans a port in a housing of the electronic device. In one or more implementations, the airflow sensor may be formed, in part, by an exposed portion of a conductive trace of the speaker.

A loudspeaker comprises a first diaphragm, a second passive diaphragm, and a drive unit coupled to the first diaphragm. The drive unit is configured to drive the first diaphragm in a direction of excursion upon applying electrical energy to the drive unit. The second passive diaphragm is arranged opposing the first diaphragm. The second passive diaphragm is mainly driven by sound waves emitted from the first diaphragm.

A voice-controlled electronic device that includes a device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include one or more microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the one or more microphones and first transducer and second transducers configured to generate sound waves within different frequency ranges.