H04R9/047

SPEAKER
20230037430 · 2023-02-09 · ·

An outer structure of a magnetic circuit is held inside a holder recess of a magnetic circuit holder of a frame. A pressing portion is screw-fixed to a mounting surface of the magnetic circuit holder. Elastically deformable pressing arms are formed at the pressing portion, and the pressing arms press a restriction surface of the outer structure of the magnetic circuit.

Multi-range speaker containing multiple diaphragms

Embodiments are disclosed of a speaker capable of producing multi-frequency-range sound using bar magnets, multiple diaphragms, and a shared planar voice coil. The planar voice coil is located between the bar magnets and translates a received electric signal into the kinetic energy that vibrates the diaphragms, thus reproducing multi-frequency range sound. In some embodiments, the speaker generates bi-directional sound.

SYSTEM AND METHOD FOR A LOUDSPEAKER WITH A DIAPHRAGM
20180014126 · 2018-01-11 ·

A loudspeaker is disclosed. The loudspeaker includes a diaphragm with a fixed portion and a movable portion. The fixed portion is attached to the movable portion by a plurality of leaf springs. A coil is disposed over the diaphragm in the movable portion of the diaphragm. A magnet assembly is operatively disposed relative to the coil, wherein upon flow of current through the coil, the movable portion of the diaphragm moves relative to the fixed portion.

PACKAGE STRUCTURE OF MICRO SPEAKER AND METHOD FOR FORMING THE SAME
20230239628 · 2023-07-27 ·

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

Planar coil linear actuator and transducer
11700488 · 2023-07-11 ·

A planar coil linear actuator/transducer. A stack of individually driven planar coils are used. A common core passes through the center of the stack of coils. A mobile magnet resides in the core. The coils are selectively energized in order to drive the magnet as desired. It is possible to control both frequency and amplitude by controlling the motion of the magnet. In a preferred embodiment, each planar coil is created as a copper (or other conductive material) trace on a multi-layer printed circuit board.

COIL
20230217180 · 2023-07-06 · ·

Coil, preferably for driving a loudspeaker, comprising a printed circuit board and at least two windings formed as conductors, wherein the conductors have different widths.

Speaker and magnetic circuit system thereof

The present disclosure relates to a speaker and a magnetic circuit system thereof. The speaker includes a housing and at least one magnetic circuit system and at least one vibration system arranged in the housing. The at least one vibration system includes at least one layer of drive circuit configured to generate mechanical motion under the action of a magnetic field of the at least one magnetic circuit system, and a diaphragm driven by the at least one layer of drive circuit. The at least one layer of driving circuit is mounted to the diaphragm and has a planar shape. Since the driving circuit of the vibration system has a planar shape, the thickness of the speaker of the present disclosure can be effectively reduced.

Hybrid movable coil plate and flat plate-type speaker using same

The present invention relates to a hybrid movable coil plate and a flat panel speaker, and more particularly, to a hybrid movable coil plate and a flat panel speaker which have improved acoustic pressure of the speaker by attaching a coil pattern printed on one surface of the movable coil plate and a copper wire coil wound on the other surface to increase inductive electromotive force. A hybrid movable coil plate for a flat panel speaker is characterized by including a spirally wound copper wire coil attached on one surface thereof and a PCB coil pattern-printed on the other surface thereof, wherein the copper wire coil and the PCB coil are formed in track shapes, a pair of lead wire connection ends are formed, and copper foils are formed in one or more via holes for electrical connection between the copper wire coil and the PCB coil, and in the vicinity of at least one among the one or more via holes.

INTEGRATED TRANSDUCER
20220394389 · 2022-12-08 ·

Disclosed is a sound transducer, which can be assembled, integrated or installed primarily in the consumer, pro audio, installation and automotive sectors on land, water and air with minimal space requirements, use of materials and weight. The transducer includes a ring sound wave shaper having a very flat, thin multi-layered, flexible membrane, which generates point-shaped or ring-shaped sound within the membrane diameter.

SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
20220386004 · 2022-12-01 · ·

A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.