The present disclosure provides a microphone including at least one acoustoelectric transducer and an acoustic structure. The acoustoelectric transducer is configured to convert a sound signal to an electrical signal. The acoustic structure includes a sound guiding tube and an acoustic cavity. The acoustic cavity is in acoustic communication with the acoustoelectric transducer, and is in acoustic communication with outside of the microphone through the sound guiding tube. The acoustic structure has a first resonance frequency, the acoustoelectric transducer has a second resonance frequency, and an absolute value of a difference between the first resonance frequency and the second resonance frequency is not less than 100 Hz. By disposing different acoustic structures, resonance peaks in different frequency ranges may be added to the microphone, which improves a sensitivity of the microphone near multiple resonance peaks, thereby improving a sensitivity of the microphone in the entire wide frequency band.

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate which includes a layer stack having a plurality of layers which form a plurality of substrate planes, and which includes a cavity within the layer stack. The MEMS transducer includes an electromechanical transducer connected to the substrate within the cavity and including an element which is deformable within at least one plane of movement of the plurality of substrate planes, deformation of the deformable element within the plane of movement and the volume flow of the fluid being causally correlated. The MEMS transducer includes an electronic circuit arranged within a layer of the layer stack, the electronic circuit being connected to the electromechanical transducer and being configured to provide a conversion between a deformation of the deformable element and an electric signal.

A microphone system includes a microphone and a pre-amplification conditioning circuit configured within a housing and comprising a pair of matched JFETs configured in a differential pair with common-source configuration and, when biased, are operable to receive and amplify the differential microphone output signal. The microphone further includes a pair of BJTs configured as a complimentary feedback transistor pair with each of the pair of BJTs coupled in parallel to a corresponding one of the pair of matched JFETs, and a current sink coupled to the matched JFETs and corresponding emitter electrodes of the BJTs and operable to maintain a fixed total direct current through each of the matched JFETs and BJTs, which reduces the JFETs corresponding electrical load, reduces signal noise, and increases a maximum amplified microphone output signal level at the drains of the matched JFETs.

A microphone system includes a microphone and a pre-amplification conditioning circuit configured within a housing and comprising a pair of matched JFETs configured in a differential pair with common-source configuration and, when biased, are operable to receive and amplify the differential microphone output signal. The microphone further includes a pair of BJTs configured as a complimentary feedback transistor pair with each of the pair of BJTs coupled in parallel to a corresponding one of the pair of matched JFETs, and a current sink coupled to the matched JFETs and corresponding emitter electrodes of the BJTs and operable to maintain a fixed total direct current through each of the matched JFETs and BJTs, which reduces the JFETs corresponding electrical load, reduces signal noise, and increases a maximum amplified microphone output signal level at the drains of the matched JFETs.

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

A vibration sensor (100) is provided, including a housing structure (110, 510, 610, 710, 810, 910, 1010, 1110, 1510, 1710) and an acoustic transducer (120, 520, 620, 720, 820, 920, 1020, 1120, 1220, 1320, 1420, 1520, 1720) physically connected to the housing structure (110, 510, 610, 710, 810, 910, 1010, 1110, 1510, 1710), wherein a first acoustic cavity (140, 1040) is formed at least partially by the housing structure (110, 510, 610, 710, 810, 910, 1010, 1110, 1510, 1710) and the acoustic transducer (120, 520, 620, 720, 820, 920, 1020, 1120, 1220, 1320, 1420, 1520, 1720), and a vibration unit (130) which is located in the first acoustic cavity (140, 1040), and separates the first acoustic cavity (140, 1040) into a second acoustic cavity (142, 542, 642, 742, 842, 942, 1042, 1142, 1242, 1342, 1442, 1542, 1642) and a third acoustic cavity (141, 941, 1041, 1141, 1541, 1641).

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.