H05B2206/044

MICROWAVE TREATMENT DEVICE
20230207273 · 2023-06-29 · ·

A microwave treatment device comprises a treatment chamber, in which an object to be treated can be arranged, and a microwave emission device, by which microwave radiation can be radiated into the treatment chamber or emitted therein. The microwave emission device comprises at least one array antenna with a plurality of individual emitters and a microwave control device which can be used to specify an emission characteristic for each individual emitter of the at least one array antenna. A phase and/or amplitude of the microwave emission can be specified for each individual emitter by the microwave control device. A phase and/or an amplitude of the microwave emission can be specified for each individual emitter by the microwave control device. Furthermore, a frequency of the microwave emission can be specified within a frequency range for each individual emitter by the microwave device.

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

There is provided a technique, which includes: a process chamber where a substrate is processed; a microwave oscillator configured to supply microwaves to the process chamber; and a controller configured to be capable of controlling the microwave oscillator to perform: a heating process where the substrate is heated with a first microwave, among the supplied microwaves, supplied at a first microwave power so that a process of supplying the first microwave during a supply time and a process of stopping the supply of the first microwave during a stop time shorter than the supply time are performed a predetermined number of times or for a first predetermined time; and a modifying process in which the substrate is supplied with a second microwave, among the supplied microwaves, at a second microwave power higher than the first microwave power for a second predetermined time while maintaining the second microwave power.

Chemical reaction apparatus

In order to provide a chemical reaction apparatus that can suppress a situation where microwaves are concentrated on a partial portion in a reactor, and that can more uniformly irradiate a content with the microwaves, a chemical reaction apparatus includes: a horizontal flow-type reactor in which a liquid content horizontally flows with an unfilled space being provided thereabove; a microwave generator that generates microwaves; and a waveguide that transmits the microwaves generated by the microwave generator to the unfilled space in the reactor, wherein a top of the reactor is curved with respect to a flow direction of the content.

HIGH FREQUENCY HEATING DEVICE

High frequency heating device is provided with heater disposed adjacent to mount base on which object to be heated is mounted and having a plurality of surface wave transmission lines electrically isolated from each other, and first and second high frequency power generators, each of which generates high frequency power having different frequency. Surface wave transmission lines receive at least one of the high frequency power generated by first high frequency power generator and the high frequency power generated by second high frequency power generator. According to this aspect, interference between the high frequency powers is not occurred and electromagnetic field coupling is not occurred. As a result, in the high frequency heating device provided with the surface wave transmission line using a periodic structure, uneven baking caused by the electromagnetic field coupling can be suppressed, and a heating state of an object to be heated can be easily controlled.

METHOD AND APPARATUS FOR CIRCULARLY POLARIZED MICROWAVE PRODUCT TREATMENT
20170333258 · 2017-11-23 ·

An apparatus for applying a field of microwave energy for the processing of an absorbent article is disclosed. The apparatus comprises an elongate chamber having a longitudinal axis and first and second circularly polarized microwave radiation transmitting device radiatingly coupled to the elongate chamber and oriented so that the microwave energy is transmitted from the first and second circularly polarized microwave radiation transmitting devices is directed toward the longitudinal axis. The elongate chamber has a surface distributed about the longitudinal axis, a proximal end providing ingress for the absorbent article into the elongate chamber, and a distal end providing egress of the absorbent article from the elongate chamber. The second circularly polarized microwave radiation transmitting device is coupled to the elongate chamber at a position relative to the longitudinal axis that ranges from about 30 degrees to about 150 degrees relative to the position of the first circularly polarized microwave radiation transmitting device.

MODULAR MICROWAVE POWER SUPPLY
20170303347 · 2017-10-19 ·

A modular microwave power supply comprises a plurality of microwave power supply modules and a plurality of isolating diodes. To upgrade the output power of the modular microwave power supply, the plurality of microwave power supply modules are connected isolatively in common to a magnetron load by the plurality of isolating diodes, such that power combining of the plurality of microwave power supply modules is achieved, and the efficiency as well as the accumulated-heat dissipating ability of the modular microwave power supply are as good as each of the plurality of microwave power supply modules.

DIRECT HEATING THROUGH PATCH ANTENNAS
20170251530 · 2017-08-31 · ·

The microwave heating apparatus (100) comprises a cavity (101) arranged to receive a load (102A, 102B), at least two patch antennas (103A, 103B) coupled to the at least one microwave generator (104), and a control unit (105). Each of the at least two patch antennas (103A, 103B) is configured to radiate microwaves into a predefined direct heating zone (108A, 108B) within the cavity proximate the respective patch antenna (103A, 103B). The control unit (105) is configured to select energy levels for each of the at least two patch antennas (103A, 103B) as if the load (102A, 102B) were static and as if there not interference between the at least two patch antennas (103A, 103B).

PACKAGED FOOD PRODUCT MICROWAVE SYSTEM AND METHOD

A microwave appliance provides safe heating of packaged food products at an efficiency greater than 90%. A temperature sensor positioned about a product holder is configured to sense a temperature of the package. A product identification scanner identifies a type of food product, a type of packaging, and/or a size of packaging being inserted into the microwave appliance. The product identification may be used to obtain a dielectric constant and/or electrical conductivity of the product. An electric field detector verifies that a suitable product has been inserted into the microwave appliance and is used to estimate a volume of the packaged food product. Accordingly, even partially full packaged food products may be safely re-heated to a desired temperature. As opposed to a time-based operation with traditional microwave appliances, operation of the microwave appliance may be adjusted based on the product identification scanner, temperature sensor, and electric field detector.

MICROWAVE COOKING SYSTEMS
20220031123 · 2022-02-03 ·

The present application firstly discloses a cooking system comprising two cooking apparatuses, each capable of producing a cooked food from food or food ingredient(s). The first cooking apparatus comprises a plurality of microwave ovens which can be moved by an intermittent motion mechanism or a transport system. The second cooking apparatus comprises a cookware and a motion mechanism to move the cookware to dispense a cooked food to a food container. A semi-cooked food is produced by a microwave oven of the first cooking apparatus and is used as an ingredient in the second cooking apparatus to produce cooked food.

Device for selective heating of materials in an electromagnetic oven
11252792 · 2022-02-15 · ·

A selective heating device may include a chamber, at least one heating element, and a circuit. The at least one heating element may selectively heat a first portion of a target in the chamber at a first energy level for a first period of time. The at least one heating element may also selectively heat a second portion of the target at a second energy level for a second period of time, wherein the second energy level and/or the second period of time are different from the first energy level and/or the first period of time; or refrain from heating a third portion of the target; or a combination thereof. The circuit may receive a heating instruction and control the at least one heating element based on the heating instruction.