The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.

The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.

A positive temperature coefficient component includes: a substrate (32); a conductive ink (36) disposed over at least a portion of the substrate (32); a positive temperature coefficient layer (38) disposed over at least a portion of the substrate (32) and/or the conductive ink (36); and a topcoat layer (42) formed from a coating composition including a dielectric material disposed over at least a portion of the positive temperature coefficient layer (38) and/or the conductive ink (36).

A positive temperature coefficient component includes: a substrate (32); a conductive ink (36) disposed over at least a portion of the substrate (32); a positive temperature coefficient layer (38) disposed over at least a portion of the substrate (32) and/or the conductive ink (36); and a topcoat layer (42) formed from a coating composition including a dielectric material disposed over at least a portion of the positive temperature coefficient layer (38) and/or the conductive ink (36).

Aspects of the invention generally relate to a display sign heating apparatus, method of making and using the same and more particularly to a display sign for preventing or mitigating snow and icing from interfering with the display.

Aspects of the invention generally relate to a display sign heating apparatus, method of making and using the same and more particularly to a display sign for preventing or mitigating snow and icing from interfering with the display.

The invention relates to a cleaning tool for an aerosol-generating device. The FIG. 1 cleaning tool comprises a cleaning head and a handle. At least a part of the cleaning head is rotatably mounted in the handle. The cleaning tool further comprises at least one suspension element arranged between the cleaning head and the handle. The suspension element is arranged to engage the cleaning head or the handle to prevent relative rotation between the cleaning head and the handle, if a torque below a predetermined threshold is applied between the cleaning head and the handle. The suspension element is configured to disengage the cleaning head or the handle, if a torque above a predetermined threshold is applied between the cleaning head and the handle

A substrate support including a body, a heating element, a first radio frequency filter, and a second radio frequency filter. The body is configured to support a substrate. The heating element is at least partially implemented in a first portion of the body. The first radio frequency filter is connected to an input of the heating element and at least partially implemented in a second portion of the body and connected to the heating element by a first via. The second radio frequency filter is connected to an output of the heating element and at least partially implemented in the second portion or a third portion of the body.

A workstation for a film-processing packaging machine defines a film transport plane in which the packaging film can be transported. In addition, the workstation comprises an electrically operable heating assembly. The latter in turn comprises an electrically conductive planar resistance heating element which in a plane parallel to the film transport plane has dimensions that are greater by a factor of at least 5, preferably at least 10, than in a direction perpendicular to the film transport plane. The resistance heating element is arranged between a heating plate and a clamping plate. The disclosure also relates to a packaging machine with such a workstation and to a method for operating such a workstation.

A workstation for a film-processing packaging machine defines a film transport plane in which the packaging film can be transported. In addition, the workstation comprises an electrically operable heating assembly. The latter in turn comprises an electrically conductive planar resistance heating element which in a plane parallel to the film transport plane has dimensions that are greater by a factor of at least 5, preferably at least 10, than in a direction perpendicular to the film transport plane. The resistance heating element is arranged between a heating plate and a clamping plate. The disclosure also relates to a packaging machine with such a workstation and to a method for operating such a workstation.