The present invention provides a heating apparatus for heating a load. The heating apparatus comprises a heater having a heating element for receiving electrical power and for converting the electrical power into heat to heat a heating surface of the heater. The heating apparatus also comprises a temperature sensor for sensing and outputting a measurement of the temperature of the heating element, a power actuator for providing the electrical power to the heating element of the heater, a power sensor for sensing and outputting a measurement of the power provided to the heating element by the power actuator, and control circuitry for controlling the power actuator to control the power delivered by the power actuator to the heating element. The control circuitry is configured to receive the temperature measurement from the temperature sensor, receive the power measurement from the power sensor, combine the temperature measurement and the power measurement, and control the power actuator in dependence upon the combined temperature measurement and power measurement. This ensures that the temperature of the heating surface is constant throughout a period when the load is applied.

An antenna has radio-frequency (RF) antenna elements and two substrates. A heater structure is connected to at least one of the two substrates, for heating the RF antenna elements. In one embodiment, the antenna comprises: a physical antenna aperture having an array of radio frequency (RF) antenna elements formed with patch and iris substrates, the iris substrate having a plurality of layers including an iris metal layer; and a heater structure coupled to one or more of the plurality of layers of the iris substrate for heating the RF antenna elements.

A heat treatment device includes: a heating plate configured to support and heat a substrate on which a resist film is formed; a chamber configured to cover a processing space above the heating plate; a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path beginning from an outer periphery of the heating plate and extending along an upper surface of the heating toward an end portion on an outer periphery of the substrate; and an exhaust port configured to evacuate inside of the chamber through exhaust holes that are formed above the processing space and open downwards.

Provided is an electric grill capable of precisely controlling the temperature of a grilling plate by directly applying a heating paste including carbon nanotubes to the bottom of the grilling plate. The present invention includes the grilling plate on which food to be cooked is placed; a heating body that is applied so as to be arranged on the lower portion of the grilling plate so as to heat the grilling plate; a heat insulating material which is disposed to be spaced apart from the heating body at a predetermined distance so as to block heat conduction to the outside; and a temperature sensor which is disposed between the heating body and the heat insulating material so as to measure the temperature of an upper plate. A pair of electrodes for supplying electricity to the heating body are arranged along opposite edges of both sides of the heating body, and a heating region can be divided and controlled by dividing and combining the pair of electrodes, the heating body, the coating thickness, and the like.

A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.

An electric heating device, in particular for mobile applications, having a substrate and a heat conductor layer formed on the substrate. The heat conductor layer is interrupted by at least a first isolating interruption, the first isolating interruption separating at least a first and a second layer portion of the heat conductor layer from one another. The first layer portion is connected at a first end to a first terminal, for example positive pole, and the second layer portion is connected at a first end to a second terminal, for example negative pole. The first layer portion is connected at a second end to the second layer portion and is connected via this second layer portion to the second terminal.

A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.

A flow heater for vehicles is described. The flow heater has a housing, which has an inlet and an outlet. A flow channel for fluid to be heated is disposed in the housing and leads from the fluid inlet to the fluid outlet. A heating plate forms a wall of a heated section of the flow channel and carries an electric heating resistor. A calorimetric flow sensor is provided for measuring a fluid flow in the flow channel.

A printed circuit board includes a conducting path shaped via a subtractive method and a heating line. The heating line is formed by the conducting path and designed to have a predetermined heating power for a heating fluid. The printed circuit board further includes a heat dispersion layer designed for transferring heat to the fluid. A heater includes such a printed circuit board.

A heating body includes: a substrate; a heating layer arranged on the substrate; and a protruding structure layer arranged on the heating layer. The protruding structure layer includes a plurality of protruding units arranged on the heating layer at intervals or the protruding structure layer has a grid shape. In an embodiment, the heating body further includes: an insulating and heat-conducting layer arranged between the protruding structure layer and the heating layer.