H05F3/04

ELECTRONIC DEVICE CAPABLE OF DISCHARGING STATIC ELECTRICITY
20230051635 · 2023-02-16 ·

An electronic device capable of discharging static electricity is disclosed. The electronic device includes a housing, an antenna arrangement region, and an electrostatic discharge guide. The antenna arrangement region is disposed inside the housing. The electrostatic discharge guide includes a first conductive region, a second conductive region, a non-conductive region, and a discharging unit. The first conductive region is disposed on an inner surface of the housing, and the antenna arrangement region is disposed in the first conductive region. The second conductive region is disposed on the inner surface of the housing. The discharging unit is located in the first conductive region and has a tip, the tip extends toward the second conductive region to cause a spacing between the tip and the second conductive region to be less than or equal to a width of the non-conductive region.

ELECTRONIC DEVICE CAPABLE OF DISCHARGING STATIC ELECTRICITY
20230051635 · 2023-02-16 ·

An electronic device capable of discharging static electricity is disclosed. The electronic device includes a housing, an antenna arrangement region, and an electrostatic discharge guide. The antenna arrangement region is disposed inside the housing. The electrostatic discharge guide includes a first conductive region, a second conductive region, a non-conductive region, and a discharging unit. The first conductive region is disposed on an inner surface of the housing, and the antenna arrangement region is disposed in the first conductive region. The second conductive region is disposed on the inner surface of the housing. The discharging unit is located in the first conductive region and has a tip, the tip extends toward the second conductive region to cause a spacing between the tip and the second conductive region to be less than or equal to a width of the non-conductive region.

Mounting table and charge neutralization method for target object
11582854 · 2023-02-14 · ·

A mounting table is provided. The mounting table includes an electrostatic chuck configured to mount thereon a target object and attract and hold the target object using an electrostatic force, and a gas supply line configured to supply a gas to a gap between the target object mounted on the electrostatic chuck and the electrostatic chuck via the electrostatic chuck. The mounting table further includes at least one irradiation unit configured to irradiate light having a predetermined wavelength to the gas flowing through the gas supply line or to the gas supplied to the gap between the target object and the electrostatic chuck to ionize the gas.

PORTABLE ELECTRONIC DEVICE WITH EMBEDDED ELECTRIC SHOCK PROTECTION FUNCTION
20180007817 · 2018-01-04 ·

Provided is a portable electronic device with an embedded electric shock protection function. A portable electronic device with an embedded electric shock protection function according to an exemplary embodiment of the present invention comprises: a circuit board; a camera module mounted on the circuit board; a conductive cover disposed to cover a part of an upper side of the camera module; a conductive connecting part mounted on the circuit board and configured to come into electrical contact with the conductive cover; and an electric shock protection element mounted on the circuit board to be connected in series to the conductive connecting part and configured to pass static electricity introduced from the conductive cover and block a leakage current of an external power source introduced into a ground of the circuit board.

PORTABLE ELECTRONIC DEVICE WITH EMBEDDED ELECTRIC SHOCK PROTECTION FUNCTION
20180007817 · 2018-01-04 ·

Provided is a portable electronic device with an embedded electric shock protection function. A portable electronic device with an embedded electric shock protection function according to an exemplary embodiment of the present invention comprises: a circuit board; a camera module mounted on the circuit board; a conductive cover disposed to cover a part of an upper side of the camera module; a conductive connecting part mounted on the circuit board and configured to come into electrical contact with the conductive cover; and an electric shock protection element mounted on the circuit board to be connected in series to the conductive connecting part and configured to pass static electricity introduced from the conductive cover and block a leakage current of an external power source introduced into a ground of the circuit board.

Automatic emitter point cleaners

Automatic emitter point cleaners are disclosed. An automatic emitter point cleaning system includes: a fan configured to direct a stream of air through an air path; a point emitter configured to produce at least one of positive ions or negative ions within or proximate to the air path; a brush; a first gear coupled to the brush and configured to move the brush into contact with the point emitter; a second gear to engage the first gear; and a motor to actuate the second gear such that the second gear actuates the first gear to move the brush past the point emitter.

LOW-VOLTAGE PLASMA IONIZER
20220418076 · 2022-12-29 ·

A low-voltage plasma ionizer is proposed. The ionizer may include a resonator module comprising a metal plate and configured to generate plasma by using an electric field, wherein the metal plate comprises a long side extending in a longitudinal direction, a short side crossing the long side, and a slot extending in the longitudinal direction. The ionizer may also include a source generator connected to the resonator module, and configured to supply a signal to the resonator module to generate plasma including plasma ions around the metal plate. The ionizer may further include a fan placed in an XY plane, and configured to move the plasma ion in a direction crossing the XY plane.

IONIZER EMITTER NOZZLES
20220393441 · 2022-12-08 ·

An example apparatus for charge neutralization comprises: an emitter nozzle comprising: an emitter; and a housing configured to hold the emitter, the housing comprising a plurality of cams on an exterior of the housing; and a nozzle receptacle configured to enable insertion and removal of the emitter nozzle, and to hold the emitter nozzle in place during operation of the emitter nozzle, the nozzle receptacle comprising: a plurality of threads corresponding to the plurality of cams on the emitter nozzle, the plurality of threads having a first flank angle; and a plurality of shelves located at respective distal ends of the plurality of threads, the plurality of shelves having a second flank angle less than the first flank angle.

Pick-up device and pick-up method

A pick-up device 10 for picking up a semiconductor chip 100 attached to a front surface of a sheet material 110 is provided with: a stage 12 that includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that attracts and holds a rear surface of the sheet material 110; a jacking-up pin 26 for jacking up the semiconductor chip 100 from the rear side of the stage 12; and a destaticizing mechanism 20 that destaticizes charge generated between the semiconductor chip 100 and the sheet material 110 by irradiating the rear surface of the semiconductor chip 100 with the destaticizing electromagnetic wave that is made to pass through the sheet material 110 from the rear side of the stage 12.

Pick-up device and pick-up method

A pick-up device 10 for picking up a semiconductor chip 100 attached to a front surface of a sheet material 110 is provided with: a stage 12 that includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that attracts and holds a rear surface of the sheet material 110; a jacking-up pin 26 for jacking up the semiconductor chip 100 from the rear side of the stage 12; and a destaticizing mechanism 20 that destaticizes charge generated between the semiconductor chip 100 and the sheet material 110 by irradiating the rear surface of the semiconductor chip 100 with the destaticizing electromagnetic wave that is made to pass through the sheet material 110 from the rear side of the stage 12.