Patent classifications
H05H1/2487
EFFICIENT MECHANICAL GENERATION OF CAVITATION IN LIQUIDS
In an embodiment, the present disclosure pertains to a cavitation generation device that includes a dactyl plunger rotatable about an axis between an open position and a closed position and a propus socket having a channel. The propus socket is rigidly mounted below the dactyl plunger, and the dactyl plunger is received into the propus socket when the dactyl plunger is in the closed position. The cavitation generation device can also include a torsion spring that biases the dactyl plunger into contact with the propus socket. In another embodiment, the present disclosure pertains to a method of inducing a cavitation including biasing a dactyl plunger via a torsion spring, and rotating the dactyl plunger, by action of the torsion spring, into a propus socket. The propus socket includes a nozzle-shaped channel. The method further includes ejecting a socket cavity volume through the nozzle-shaped channel thereby inducing a cavitation event.
Efficient mechanical generation of cavitation in liquids
In an embodiment, the present disclosure pertains to a cavitation generation device that includes a dactyl plunger rotatable about an axis between an open position and a closed position and a propus socket having a channel. The propus socket is rigidly mounted below the dactyl plunger, and the dactyl plunger is received into the propus socket when the dactyl plunger is in the closed position. The cavitation generation device can also include a torsion spring that biases the dactyl plunger into contact with the propus socket. In another embodiment, the present disclosure pertains to a method of inducing a cavitation including biasing a dactyl plunger via a torsion spring, and rotating the dactyl plunger, by action of the torsion spring, into a propus socket. The propus socket includes a nozzle-shaped channel. The method further includes ejecting a socket cavity volume through the nozzle-shaped channel thereby inducing a cavitation event.
Plasma source and method for removing materials from substrates utilizing pressure waves
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
PLASMA SOURCE AND METHOD FOR REMOVING MATERIALS FROM SUBSTRATES UTILIZING PRESSURE WAVES
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
Plasma source and method for removing materials from substrates utilizing pressure waves
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
EFFICIENT MECHANICAL GENERATION OF CAVITATION IN LIQUIDS
In an embodiment, the present disclosure pertains to a cavitation generation device that includes a dactyl plunger rotatable about an axis between an open position and a closed position and a propus socket having a channel. The propus socket is rigidly mounted below the dactyl plunger, and the dactyl plunger is received into the propus socket when the dactyl plunger is in the closed position. The cavitation generation device can also include a torsion spring that biases the dactyl plunger into contact with the propus socket. In another embodiment, the present disclosure pertains to a method of inducing a cavitation including biasing a dactyl plunger via a torsion spring, and rotating the dactyl plunger, by action of the torsion spring, into a propus socket. The propus socket includes a nozzle-shaped channel. The method further includes ejecting a socket cavity volume through the nozzle-shaped channel thereby inducing a cavitation event.
PLASMA SOURCE AND METHOD FOR REMOVING MATERIALS FROM SUBSTRATES UTILIZING PRESSURE WAVES
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
Plasma source and method for removing materials from substrates utilizing pressure waves
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
PLASMA SOURCE AND METHOD FOR REMOVING MATERIALS FROM SUBSTRATES UTILIZING PRESSURE WAVES
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.