A method for forming a film on a substrate by continuous vapor deposition includes: introducing the substrate into a film-forming apparatus; conveying the substrate into a pretreatment compartment of a pressure reduction chamber of the film-forming apparatus; performing plasma pretreatment of the substrate including supplying a plasma source gas composed of argon and at least one of oxygen, nitrogen, carbon dioxide gas and ethylene, introducing the plasma source gas that has been supplied as plasma into a gap between a magnet of the pretreatment compartment and a pretreatment roller such that the plasma is entrapped in the gap, and holding the plasma and applying a voltage between the pretreatment roller and a plasma-supply nozzle; conveying the substrate into a vapor deposition compartment of the pressure reduction chamber; and forming the film by vapor deposition on a surface of the substrate which has been pretreated.

A discharge electrode E in an electrode chamber C comprises a plurality of electrode members 8, 9. The electrode members 8, 9 are disposed facing each other by having a supporting member 4 therebetween, a gap is formed between the facing portions of the electrode members 8, 9, and by having the gap as a gas passageway 15, the gas passageway is opened in the leading end of the discharge electrode. A replacement gas having been supplied from a manifold pipe 3 is supplied to the gas passageway 15 via an orifice.

In a method and device for conversion of water into hydrogen peroxide (H.sub.2O.sub.2), a corona discharge zone is generated between a first electrode (10) and a second electrode (6) one of which is insulated and another of which is not insulated and wherein a respective surface of each of the electrodes face one another. The first electrode (10) is rotated so as to induce relative rotation between the first electrode and the second electrode; and liquid water is conveyed on to a surface of the first electrode facing the second electrode close to the axis of rotation (4) of the first electrode whereby the liquid water advances outward through the corona discharge zone towards a periphery of the first electrode under the action of centrifugal force caused by rotation of the first electrode.

The present disclosure describes material surface treatment systems and methods that employ a byproduct treatment system to receive a byproduct generated by application of a plasma, the byproduct treatment system configured to degrade the byproduct and exhaust the degraded byproduct from the material surface treatment. The disclosed byproduct treatment system modifies the byproduct prior to evacuation from the material treatment system in order to reduce or eliminate byproduct contamination into the surrounding atmosphere.

The present disclosure describes material surface treatment systems and methods for grafting a coded substance (e.g., a molecular code) to a material through a surface treatment process. In some examples, the material is subjected to a plasma discharge containing the molecular code, which is grafted onto the material at the molecular level thereby having little or no impact on the properties of the treated material.

A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH.sub.4, H.sub.2O, H.sub.2, NF.sub.3, SF.sub.6, F.sub.2, HCl, HF, Cl.sub.2, and HBr. Representative condensing abating reagents include, for example, H.sub.2, H.sub.2O, O.sub.2, N.sub.2, O.sub.3, CO, CO.sub.2, NH.sub.3, N.sub.2O, CH.sub.4, and combinations thereof.

Invention relates to air cleaning systems, particularly to electric air cleaners, and may be used for decontamination of air in different industries. Invention is directed to attaining a technical effect of providing an air cleaning device, where air is cleaned owing to action of corona discharge streamers on air molecules and contamination particles. Technical effect is attained by air cleaning device that contains a high-voltage pulse generator, an outer electrode provided as a grounded metal tube, and an inner electrode rigidly secured along the tube axis by a fastening member and provided in form of a metal rod and configured so as pulsed corona discharge streamers are formed in between the inner and outer electrodes, wherein the inner electrode is spaced by a gap from an output electrode of high-voltage pulse generator and size of the gap assures breakdown of the gap with pulses formed by high-voltage pulse generator.

The present invention relates to a plasma generating apparatus for a secondary battery. The plasma generating apparatus for the secondary battery comprises a roller part comprising a transfer roller that transfers a separator and a metal member built in the transfer roller, and a plasma generating part comprising a main body spaced apart from the transfer roller and a plurality of electrode members disposed on positions that are spaced apart from each other in a direction of both ends of the main body and partially generating a plasma between the metal member and the main body to form a patterned bonding layer on a surface of the separator, wherein the plurality of electrode members are detachably coupled to the main body to adjust a number of the electrode members coupled to the main body based on a size of the separator.

The present disclosure describes systems and methods to provide electrode cooling for material surface treatment systems. A cooling fluid is employed to cool electrodes with a high voltage applied. For example, a conduit conveys a cooling fluid through the electrode, as the conduit also provides electrification for the electrode by being connected to an electrical power source. Further, cooling is implemented by use of a voltage isolator disposed between the conduit and a reservoir, with the voltage isolator providing a pathway to a reference voltage for residual electric charge from the cooling fluid passing through the voltage isolator.

A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the substrate support, and a plurality of electrodes connecting the top plate to the bottom plate. A voltage is applied to the plurality of electrodes to generate an electric field. Methods for exposing a photoresist layer on a substrate to an electric field are also disclosed herein.