A through connector device is disclosed. The device may include a coaxial cable receiver portion defined by one or more surfaces, the coaxial cable receiver portion configured to couple to a center conductor portion of a coaxial cable, the center conductor portion of the coaxial cable protruding above a dielectric material of the coaxial cable. The device may include a beam lead positioned adjacent to the coaxial cable receiver portion. The device may include a planar transmission line contact pad configured to make electrical contact with a planar transmission line of a printed circuit board. The device may include a step configured to electrically and mechanically couple the beam lead to the planar transmission line contact pad, the step configured to create a gap between a bottom surface of the beam lead and a top surface of an outer conductor portion of the coaxial cable.

A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 .Math.m to 2.0 .Math.m. The wiring lines have an average height of 40 .Math.m to 120 .Math.m. The wiring lines have an average spacing of 1 .Math.m to 30 .Math.m.

A modularly expandable electronic control unit comprises: an electronic circuit board on which a conductor track is disposed on a side in a region of lateral edges and enclosing an inner region and separating it from an outer region of the side, a housing having two halves for receiving the electronic circuit board. With the housing assembled, at least one housing half has an encircling electrically conductive shielding wall which rests on and establishes electrical contact with the conductor track and/or has at least one receptacle accessible from outside the assembled housing. The receptacle is disposed so the electronic module placed in the receptacle may be electrically connected to a module connection port disposed in the outer region of the electronic circuit board. The electronic circuit board has electrical connections between the module connection port and one or more electronic assemblies disposed on the inner region.

A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.

A stretchable mounting substrate that includes: a stretchable wiring substrate, the stretchable wiring substrate including a stretchable base material and a stretchable wiring arranged on the stretchable base material; and a module on a surface of the stretchable wiring substrate, the module including a multilayer substrate, a plurality of electronic components on a principal surface of the multilayer substrate, a plurality of first electrodes and a plurality of second electrodes, and internal wirings inside the multilayer substrate. The module has a first electrode arrangement region where the plurality of first electrodes are arranged and a second electrode arrangement region where the plurality of second electrodes are arranged, and includes a node electrode pair, and the internal wiring of the node electrode pair and the stretchable wiring on the stretchable base material intersect each other in plan view of the stretchable wiring substrate.

An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.

A multi-channel filter with a PCB with a first side with signalling tracks and shielding tracks between neighbouring signalling tracks. On the second side, a conductive layer is provided. The signalling tracks are covered by an electromagnetically absorbing material, such as a powder of an electrically conducting material is provided. The filter may have sections with reversed structure where the conductors are on the second side and the layer on the first side, where the conductors on opposite sides are interconnected. The filter may be rolled or folded.

A signal transmission line includes first and second base materials, and conductive bonding materials. The first base material includes a signal conductor. The second base material includes a ground conductor. The conductive bonding materials bond the first base and second base material to provide a gap. The first base material includes a mounting conductor to which the conductive bonding materials are respectively bonded. The mounting conductor includes a portion extending in parallel or substantially in parallel with the signal conductor on a side of a first side surface, and a portion extending in parallel or substantially in parallel with the signal conductor on a side of a second side surface. A position of a portion of the mounting conductor on the side of the first side surface and a position of a portion of the mounting conductor on the side of the second side surface are different from each other in a signal transmission direction.

A sensor apparatus according to an embodiment of the present technology includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.

The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.