An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.

An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member. The control circuit may be configured to, when the first electrically conductive pad is shorted to the second electrically conductive pad, cause the at least one electrical component to be electrically coupled to the battery and when the first electrically conductive pad is electrically isolated from the second electrically conductive pad, cause the at least one electrical component to be electrically decoupled from the battery.

The invention relates to a device having: —a circuit carrier board (3) and—a conductor element (2), which is designed to transfer an electric current from and/or to the circuit carrier board (3), characterized by: —an electrically conductive, elastically deformable, contoured, plate-like connection element (1), which connects the circuit carrier plate (3) to the conductor element (2) and is designed to create a local, dynamic resilience, as a result of which a force transmission (F) from the conductor element (2) to the circuit carrier plate (3) can be reduced, and—a plate thickness of the connection element (1) of at least 2 cm. The invention also relates to a power converter (4) and an aircraft (6) having such a device.

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

When an upper contact part is not in contact with a signal pad, a lower contact part is not in contact with a short-circuiting pad, and when the upper contact part comes into contact with the signal pad and an elastic deformation part is elastically deformed, the lower contact part comes into contact with the short-circuiting pad. The current path length from the upper contact part to the lower contact part is shorter than the current path length from the upper contact part to a soldering part.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

A hybrid edge connector includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a card inserted in the slot such that each terminal has multiple contact points to the card and can carry a large current. To support a large current, the card may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.

Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section. section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

A humidity-adjusted power supply includes a power supply circuit (e.g., relatively higher-voltage circuit) connected to a printed circuit board. The power supply circuit is adapted to provide output voltage to a voltage load. The humidity-adjusted power supply also includes a humidity control circuit (e.g., relatively lower-voltage circuit) connected to the printed circuit board adjacent the power supply circuit. The humidity control circuit outputs a heater control signal to a heater that is also connected to the printed circuit board. The heater is in a location to receive the heater control signal from the humidity control circuit. The power supply circuit and the humidity control circuit are positioned, relative to each other, on the printed circuit board to experience the same environmental conditions.

A circuit including a die and an integrated passive device. The die includes a first substrate and at least one active device. The integrated passive device includes a first layer, a second substrate, a second layer and an inductance. The inductance includes vias, where the vias are implemented in the second substrate. The inductance is implemented on the first layer, the second substrate, and the second layer. A resistivity per unit area of the second substrate is greater than a resistivity per unit area of the first substrate. The third layer is disposed between the die and the integrated passive device. The third layer includes pillars, where the pillars respectively connect ends of the inductance to the at least one active device. The die, the integrated passive device and the third layer are disposed relative to each other to form a stack.