An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space

A high-frequency circuit includes a first electric conductor layer, a first dielectric layer, a circuit layer, a second dielectric layer, a second electric conductor layer arranged in this order, and the circuit layer includes a ground pattern and a transmission line of a high-frequency signal. An electromagnetic wave shield is disposed around the transmission line. The electromagnetic wave shield includes a ground electric conductor on inner surfaces of a plurality of holes extending through the first dielectric layer, the ground pattern, the second dielectric layer, the first electric conductor layer, and the second electric conductor layer. The plurality of holes are a plurality of elongated holes provided at an interval in a direction in which the transmission line is surrounded. In each of the plurality of elongated holes, a longitudinal dimension in the direction in which the transmission line is surrounded is larger than a width dimension.

Disclosed are apparatus comprising a substrate and techniques for fabricating the same. The substrate may include a first metal layer having signal interconnects on a first side of the substrate. A second metal layer may include ground plane portions on a second side of the substrate. Conductive channels may be formed in the substrate and coupled to the ground plane portions. The conductive channels are configured to extend the ground plane portions towards the signal interconnects to reduce a distance from individual signal interconnects to individual conductive channels. The distance may be in a range of seventy-five percent to fifty percent of a substrate thickness between the first metal layer and the second metal layer.

A printed circuit board of an information handling system includes a dielectric layer, adjacent differential pairs, a ground layer, and a ground wall. The adjacent differential pairs are plated on the dielectric layer, and generate crosstalk between each other. The ground wall is in physical communication with and electrically coupled to the ground layer. The ground wall extends substantially perpendicular from the ground layer through the dielectric layer. A top surface of the ground wall is a specific height above a top surface of the adjacent different pairs. The ground wall suppresses the generated crosstalk based on the specific height and a width of the ground wall.

A printed circuit board includes: a first layer including a first ground including a first opening, wherein a first ground wire is within the first opening; a second layer disposed in a direction from the first layer and including a second ground including a second opening, wherein the second opening at least partially overlaps with the first opening and wherein a second ground wire is within the second opening; a third layer between the first layer and the second layer and including a third opening, wherein the third opening at least partially overlaps with the first opening and wherein a first via pad is within the third opening; and a fourth layer between the second layer and the third layer and including a fourth opening, wherein the fourth opening at least partially overlaps with the third opening and wherein a second via pad is within the fourth opening.

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

A circuit structure includes a circuit board, microstrips, a stripline, and vias. The circuit board includes conductive levels. A first and second transceiving circuits are disposed on a first conductive level. A first microstrip is disposed on the first conductive level, and configured to couple a first pin of the first transceiving circuit to a second pin of the second transceiving circuit. A second and third microstrips are disposed on the first conductive level, and coupled to a third pin of the first transceiving circuit and a fourth pin of the second transceiving circuit, respectively. The stripline is disposed on a second conductive level. A first and second vias cross the first and second levels, and couple the second and third microstrips to the stripline. The first and third pins are an inner and outer pins of a front line of a BGA of the first transceiving circuit, respectively.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.