According to an example, an air dielectric printed circuit board (PCB) may include a first PCB layer including a first substrate and a first conductive layer formed of a first conductive material, and a second PCB layer including a second substrate and a second conductive layer formed of a second conductive material. The second conductive layer may be disposed in a directly facing configuration relative to the first conductive layer, and at a predetermined distance away from the first conductive layer to provide an air dielectric gap between the first and second conductive layers. The air dielectric PCB may further include a standoff that includes a first end and a second end that is opposite to the first end. The standoff may be attached to the first and second PCB layers respectively at the first and second ends thereof, and may include a predetermined length to maintain the predetermined distance.

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.

An antenna device includes a resin multilayer board in which a plurality of resin sheets are stacked, and a coil conductor provided in the resin multilayer board. A plurality of line portions of the coil conductor are provided on a lower surface of the resin sheet. When a magnetic material core is preliminarily pressure-bonded to the resin sheet, the magnetic material core is fractured along the line portions and cracks occur. Thus, the resin sheet with the magnetic material core in which the cracks have been formed is fully pressure-bonded together with the other resin sheets.

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

A band stop filter can include a circuit board having a first surface and an opposing second surface. The circuit board can have a transmission line on the first surface. The band stop filter can include a dielectric cavity resonator physically coupled to the second surface of the circuit board. The dielectric cavity resonator can have a coupling aperture configured to magnetically couple the dielectric cavity resonator to the transmission line, and to cause excitation of the dielectric cavity resonator in a second order transverse electric (TE) mode.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

Apparatus for communicating across an isolation barrier. In one embodiment, the apparatus comprises a transformer having a first winding disposed on a first side of a printed circuit board (PCB) and coupled to a first local ground, and a second winding disposed on a second side of the PCB, the second side opposite to the first side, and coupled to a second local ground; a transmitter coupled to the first winding; and a receiver, coupled the second winding, that generates an output signal based on a signal received from the transmitter.

An object has a first conductor structure, an electronic unit, a second conductor structure galvanically isolated from the first conductor structure and/or from the electronic unit but coupleable electrically thereto, and a carrier structure with a first pliable carrier layer having a first carrier layer region and with a second carrier layer region. The carrier structure is a layer stack in a base surface region including at least part of the carrier structure base surface and includes at least the first and second carrier layer regions. At least part of the conductor structures is in the base surface region. The first conductor structure and/or the electronic unit is joined with the first carrier layer region. The second conductor structure is joined with the second carrier layer region and coupleable electrically to the first conductor structure and/or the electronic unit by a layer stack surface region outside the electronic unit.