A method for preventing corona effects in an electronic circuit comprising applying a coating of a first material to a surface of the electronic circuit, and applying a second material having a dielectric constant that is lower than that of the first material on an exposed surface of the first material, wherein the second material comprises a solid dielectric.

A method for protecting the components of a printed circuit board which is loaded with specified components includes setting up a coating barrier in the form of an edge around coating exclusion regions of a printed circuit board into which a protective coating does not penetrate, and providing the printed circuit board with the protective coating at specified regions thereof. A printed circuit board produced by the method is also disclosed.

A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

A circuit comprises a first printed circuit board (60) carrying a first set of components and a second printed circuit board (62) carrying a second set of components, with a clearance (64) between the first and second printed circuit boards. A transformer (66) has a primary side connected to the first set of components and a secondary side connected to the second set of components. One of the transformer windings, and its connection to a respective set of components, comprises a triple insulated wire. A glass, ceramic or mica spacer (70) mounted to the first and second printed circuit boards defines and sets the clearance (64) between the first and second printed circuit boards. The clearance requirement is met by providing separate printed circuit boards with spacing between them and the use of a triple insulated wire addresses or overcomes issues of creepage. Thus, high frequency and high voltage operation on the first printed circuit board is possible.

An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 3.7×10.sup.5 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 2.8×10.sup.5 cpm to 3.2×10.sup.5 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

A vehicle headlamp module, including an electrical circuit arrangement for controlling at least one function of a vehicle headlamp, and a housing for at least partially accommodating the electrical circuit arrangement, wherein the housing at least in certain sections has a metallic electrically conductive shielding surface facing the circuit arrangement for electromagnetically shielding the circuit arrangement. The electrical circuit arrangement has at least one contact-sensitive surface section that is constructed in a substantially planar manner, is free from electrical components arranged thereon, and faces a planar section of the shielding surface of the housing. Electrical conductor tracks and/or contacts run along the contact-sensitive surface section, wherein a number of cured electrically non-conductive adhesive dots is arranged on the contact-sensitive surface section that is constructed in a substantially planar manner, which protrude from the contact-sensitive surface section in the direction of the planar section of the shielding surface of the housing to ensure a minimum spacing between the contact-sensitive surface section and the planar section of the shielding surface of the housing.

An electric machine is provided. The electric machine includes a stator having an electromagnetic coil and a rotor. The rotor is configured to rotate relative to the stator. The electric machine further includes a controller. The controller is adapted to control the electromagnetic coil. The controller includes a plurality of electrical components and an isolation member. The isolation member includes a first portion positioned in a first direction between two adjacent electrical components of the plurality of electrical components and a second portion positioned in a second direction normal to the first direction.

A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

A printed circuit board includes: a base substrate including a unit region; a plurality of connection pads disposed on one surface of the base substrate; and first and second lead-in lines disposed on the one surface and respectively connected to at least a portion of the plurality of connection pads. The first and second lead-in lines have first and second cut surfaces on the one surface, respectively. The first cut surface is disposed in a position spaced apart from a side surface of the printed circuit board. The second cut surface is exposed to the side surface of the printed circuit board.