A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.

A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

Exemplary systems and methods enable efficient and reliable positioning, assembly, retention, interconnection, and management of battery cells in battery packs, for example battery packs utilized in electric vehicles.

An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas spaced apart from one another along the first direction. The multilevel package substrate includes a conductive structure having first and second ends and conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end, where the conductive structure includes indents that extend into the conductive portions in the first level, the indents spaced apart from one another along the first direction and positioned along the first direction between respective pairs of the landing areas.

An electric compressor includes: a circuit board on which a plurality of switching elements (33) are mounted; a compression mechanism which is driven by a motor operated using AC power output from the switching elements (33); and a lead holding member (50) disposed between element main bodies (33a) of the switching elements (33) and the circuit board. The circuit board includes a plurality of through-holes through which a plurality of leads (33b) that extend from the element main bodies (33a) can be respectively inserted. The lead holding member (50) includes lead insertion holes (53) through which the leads (33b) can be inserted such that positions of the leads (33b) is held at positions that correspond to positions of the through-holes.

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection teiiuinals The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

Exemplary systems and methods enable efficient and reliable positioning, assembly, retention, interconnection, and management of battery cells in battery packs, for example battery packs utilized in electric vehicles.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

A power conversion device includes: semiconductor switching elements; a housing on which the semiconductor switching elements are fixed; a circuit board on which a driving circuit for driving the semiconductor switching elements is mounted and which is located opposite to and spaced apart from a fixing surface; insertion guides which are disposed on an opposing surface of the circuit board relative to the fixing surface; and elongated terminal extension members each having a length that is matched with a height of a pulse transformer, one ends of which are bonded to respective lead terminals, and the other ends of which extend toward the insertion guides; wherein the pulse transformer is disposed on the opposing surface so as to be opposite to major surfaces of the semiconductor switching elements.