Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.

A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

A lens module includes a holder, at least one lens, a base, a sensor, an anisotropic conductive film, a flexible circuit board, and a filling member. The filling member is arranged at a side of the sensor and received in the holder. Along a direction of an optical axis of the lens module, a distance between the side of the sensor and the anisotropic conductive film is defined as a first value, a thickness of the filling member is defined as a second value, a ratio of the second value to the first value is in a range of 0.8 to 1. An electronic device having the lens module is also provided.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.