Patent classifications
H05K1/165
TRANSFORMER AND POWER SUPPLYING DEVICE INCLUDING THE SAME
A transformer includes: a magnetic core including a lower magnetic structure and an upper magnetic structure; a printed circuit board arranged between the lower magnetic structure and the upper magnetic structure and including a core hole through which a midsection of the magnetic core penetrates, a primary coil, a secondary coil, a primary via-hole formed at an end of the printed circuit board and electrically connected to the primary coil, and a secondary via-hole formed at another end of the printed circuit board and electrically connected to the secondary coil; a primary pin inserted into the primary via-hole; a secondary pin inserted into the secondary via-hole; an insulating block into which a portion of the printed circuit board is inserted; and a mount on which the printed circuit board and the insulating block are mounted.
MULTILAYER BOARD AND METHOD OF MANUFACTURING THE SAME
A multilayer board includes thermoplastic resin layers laminated together, a first-class conductor pattern including a conductor foil on a first surface of one of the thermoplastic resin layers, a second-class conductor pattern in contact with a second surface of the one of the thermoplastic resin layers, and an interlayer connection conductor in the one of the thermoplastic resin layers and including a first end surface connected to the first-class conductor pattern and a second end surface connected to a second-class conductor pattern. The second-class conductor pattern and the first interlayer connection conductor include a conductor of a single material including a resin, or a conductor of a single material including a metal with a melting point lower than that of the conductor foil.
STATOR AND ROTOR DESIGN FOR PERIODIC TORQUE REQUIREMENTS
Disclosed is a motor or generator comprises a rotor and a stator, wherein the rotor has an axis of rotation and is configured to generate first magnetic flux parallel to the axis of rotation, the stator is configured to generate second magnetic flux parallel to the axis of rotation, and at least one of the rotor or the stator is configured to generate a magnetic flux profile that is non-uniformly distributed about the axis of rotation. Also disclosed is a method that involves arranging one or more magnetic flux producing windings of a stator non-uniformly about an axis of rotation of a rotor of an axial flux motor or generator.
Inductor and circuit structure and method of manufacturing the same
An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.
Optical image stabilization with voice coil motor for moving image sensor
In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.
Electronic device including antenna
An electronic device includes a housing including a front plate and a rear plate disposed opposite the front plate, and a display disposed in a space between the front plate and the rear plate, and disposed at least partially along the front plate. The electronic device further includes a first antenna structure disposed in the space and configured to transmit or receive a first signal in a first frequency band, wherein the first antenna structure includes at least one first conductive pattern. The electronic device also includes a second antenna structure disposed in the space without being overlapped with the first conductive pattern when viewed from above the rear plate, and configured to transmit or receive a second signal in a second frequency band different from the first frequency band. In addition, the electronic device includes a conductive sheet disposed in the space and on the rear plate. The conductive sheet is physically separated from the first conductive pattern, and at least partially overlapped with the first conductive pattern when viewed from above the rear plate.
SIGNAL TRANSMISSION CIRCUIT
A signal transmission circuit for transmitting an insulation signal includes: a multilayer substrate including a plurality of layers; and a pattern transformer disposed on the multilayer substrate. The pattern transformer includes a primary winding having a wound printed pattern wiring provided in each of a first plane region and a second plane region of the multilayer substrate, and a secondary winding disposed at a different position from the primary winding in a layer direction and having a wound printed pattern wiring provided in each of the first plane region and the second plane region of the multilayer substrate. The primary winding and the secondary winding are electromagnetically coupled and configured such that a current flows clockwise through one of the wound printed pattern wiring provided in the first plane region or the wound printed pattern wiring provided in the second plane region while a current flows counterclockwise through the other.
GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER, HIGH-FREQUENCY MODULE USING THE SAME, AND METHOD OF MANUFACTURING GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER
A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.
FLEXIBLE ELECTRODE CIRCUIT CAPABLE OF BEING 3D CIRCUIT PRINTED STRAIN SENSOR USING SAME, AND MANUFACTURING METHOD THEREFOR
Proposed are a flexible electrode circuit capable of being foamed through 3D circuit printing, a strain sensor using the same, and a manufacturing method thereof. The flexible electrode circuit includes a flexible substrate and an electrode foamed on the flexible substrate. The electrode includes a conductive line layer and a passivation layer. The conductive line layer includes a matrix including an elastic polymer and a conductive line having conductive liquid metal microparticles dispersed in the matrix. The passivation layer includes a coating portion coated on the conductive line and having an elastic polymer.
Printed circuit board
A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.