A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.

A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

A resistor-embedded circuit board and a method for processing the resistor-embedded circuit board are provided by the present disclosure. By opening an embedded-resistor cavity on a substrate, embedding a resistor into the embedded-resistor cavity to acquire a circuit board containing a built-in resistor. By opening the embedded-resistor cavity, it is very easy to realize high-precision control of a shape and a thickness of an embedded resistor, and realize very high-precision resistor-embedding; and it is easy to realize high-precision and massive processing. In a resistor-embedded layer, a resistor is built in a substrate. Then, in a process of pressing, a crack and a relatively large deformation will not be caused after pressing due to an irregular surface of the resistor-embedded layer, thereby improving a reliability and a quality rate of the circuit board.