A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

A pressure sensor element and a receiving circuit are formed on an IC chip. A transmitting circuit and a piezoelectric element of an actuator are respectively formed on a transmitting chip and a piezoelectric chip. The piezoelectric chip and the pressure sensor face each other separated by a distance in an airtight first space surrounded by a package main body and a base substrate. Dielectric breakdown voltage of signal transmission from the primary side to the secondary side is set by the distance. The first space is a pressure propagation region including an insulating medium capable of transmitting vibrations of the piezoelectric element as pressure. The signal transmission is performed with high insulation by the pressure generated in the pressure propagation region between components integrated in a single module by insulating the primary side and the secondary side from each other by the insulating medium of the pressure propagation region.

Provided is a method for manufacturing a printed circuit board with electronic component; including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The stack has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section. The cavity stack section at least partially surrounds the central stack section, and the thickness of the central stack section is greater than the thickness of the cavity stack section.

A voltage regulator module includes a circuit board, a positive input terminal, a negative input terminal, a positive output terminal, a negative output terminal, a switching circuit, a magnetic element and an input capacitor. The switching circuit is disposed on a top surface of the circuit board, and comprises two switches connected in series to form a midpoint, wherein the switching circuit is connected to the positive input terminal. The magnetic element comprises a magnetic core and a conductive structure in the circuit board, wherein the magnetic element and the switching circuit are arranged on the circuit board along a first direction, the conductive structure is connected to the midpoint of the corresponding switching circuit and the positive output terminal. The input capacitor is connected to the positive input terminal and the negative input terminal, and disposed on a bottom surface of the circuit board.

A vehicle, an antenna assembly of the vehicle, and a method of assembling the antenna is disclosed. The vehicle includes a housing having a passage formed therethrough. A circuit board is disposed within the housing. An antenna element is coupled to the circuit board and passes through the passage. A plug fills an annular volume of the passage between the antenna element and the housing.

An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

A terminal and a central electrical box are disclosed. The terminal is used to be mounted on a circuit board. The terminal comprises: a first termination part; a second termination part; and a bending part connected between the first termination part and the second termination part. The bending part is bent by a predetermined angle relative to the first termination part and the second termination part, so that the first termination part and the second termination part are staggered by a predetermined distance along a direction transverse to a direction of inserting the terminal to the circuit board. When the terminal is mounted on the circuit board, one of the first termination part and the second termination part passes through the circuit board. In the present invention, the terminal passes through the circuit board, so that two electronic devices located on both sides of the circuit board can be directly electrically connected through the terminal. Therefore, the number of terminals is reduced, and there is no need to set wiring for electrically connecting the terminals on the circuit board, which greatly reduces the cost.

A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.

A semiconductor device includes a substrate, a semiconductor chip, a resin, and a terminal. The substrate spreads along a first surface. The semiconductor chip is provided above the substrate in a first direction. The resin covers the semiconductor chip. The terminal is provided below the substrate in the first direction. The resin includes a first portion and a second portion. A height of the first portion in the first direction is higher than a height of the second portion in the first direction. An edge of the second portion in a second direction along the first surface is a part of an edge of the resin in the second direction.