A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

A system and method are directed to a fan board sled assembly comprising a fan circuit board including a first end and an opposing second end, a fan cage module including a front section for receiving and removably securing the first end of the fan circuit board to the fan cage module, and a guide bracket including a base section for receiving and removably securing the second end of the fan circuit board to the guide bracket. The fan cage module further includes a back section for receiving one or more fan bodies. The combined fan circuit board, fan cage module and guide bracket are a single integrated unit insertable and extractable from a chassis opening of a computer chassis.

A system and methods are provided for assisting with manual assembly of a printed circuit board (PCB), including a camera, oriented to capture a camera image of some or all of the PCB, and a processor configured to determine according to the camera image, a registration between a physical position of the PCB and a PCB layout; to receive a PCB worklist of tasks to perform on components of the PCB; to determine, according to the registration and the worklist, a position on the PCB at which a task is to be performed; and responsively to generate an overlay image to visually indicate the position on the PCB at which the task is to be performed.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

A system and method are directed to a fan board sled assembly comprising a fan circuit board including a first end and an opposing second end, a fan cage module including a front section for receiving and removably securing the first end of the fan circuit board to the fan cage module, and a guide bracket including a base section for receiving and removably securing the second end of the fan circuit board to the guide bracket. The fan cage module further includes a back section for receiving one or more fan bodies. The combined fan circuit board, fan cage module and guide bracket are a single integrated unit insertable and extractable from a chassis opening of a computer chassis.

An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.