A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

A storage unit includes an accumulation structure defined by a plurality of vertical walls having a plurality of guides arranged horizontally and configured to support a plurality of trays. In each tray there is at least one shaped housing that accommodates at least one object and on the sides of the tray there are shaped edges configured to be slidingly coupled with the guides when the tray is inserted between two consecutive vertical walls. Each tray is configured so as to receive on its upper surface one or more spacer elements that can be superimposed to one another and to the upper surface and connected to one another and to the upper surface through removable connections in order to vary the depth of the shaped housing. Movers are provided that are suited to move the trays with the objects arranged thereon and to insert/extract the trays in/from the guides.

A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.

An IC unit unloading system including a chute and a drawer. The chute has a plurality of channels each arranged to receive a unit. The drawer is arranged to move along the chute and has a gate with a unit contact face proximate a top surface of the chute. The contact face is arranged to draw the units along the respective channel as the drawer moves along the chute, and to allow the units to slide laterally across the contact face from a first pitch of each channel to a second pitch. A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project the ball face downwards, then; washing the ball face.

The disclosure relates to an electronic component packing reel for a tape and reel packaging system and the electronic components are supported in pockets of a carrier tape wound around the reel, the packing reel includes: a central hub; two wall elements attached on both sides of the centrale hub defining a retaining space for retaining the carrier tape wound around the central hub; a hub insert arranged for placement of the hub insert over the central hub, the hub insert having an outer rim diameter for increasing a diameter of the central hub, and the hub insert includes at least two sections having mating locking means for interlocking the sections upon placement of the hub insert over the central hub.

A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.

A cover tape for packing an electronic component includes: a substrate layer; a heat sealing layer placed on one surface side of the substrate layer; and an intermediate layer placed between the substrate layer and the heat sealing layer, and a transmitted image definition based on JIS K 7374, with an optical comb width set to 0.5 mm, is 30% or more.