The invention discloses electrical equipment, an integrated circuit's loop thereof and a circuit connecting method. The integrated circuit's loop includes: a passive component part, including a power device and/or an execution device; and one or more electrical components, each of the electrical components including a body and multiple pins, wherein at least one pin extends to an electrical connecting end of the passive component part, and is electrically connected with the electrical connecting end. In the integrated circuit's loop of the invention, the pins of the electrical components extend to electrical connecting ends of the passive component part, and are electrically connected with the electrical connecting ends, so that the electrical components are not required to be arranged on a Printed Circuit Board (PCB), a physical structure of the circuit configuration is simplified, a size of the circuit is reduced, and the technician is not required to design the PCB.

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and/or the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. Thereby, aforementioned design with heat dissipation slots and/or heat dissipation holes solve a problem of uneven surface temperatures of the crimping tool tip caused by a transmission of most of the heat generated by the heating rod, directing towards a central position of the crimping tool tip, such that a uniformity of surface temperatures of the crimping tool tip is ensured to control a temperature difference between both left and right ends and a central portion of a lower surface of the crimping tool tip to be constrained within 10° C. so as to offer guarantee for a uniformity of reactions of the conductive adhesive, resulting in an enhanced crimping quality.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

An improvement to a lead forming system that provides quick changeover without complete disassembly. By removing a pair of fasteners securing a pair of die inserts, a spring pack in an upper die unit can be freely rotated and interchanged or modified. The spring pack has a plurality of chamfers that allow the spring pack to rotate within the die pack until a narrower side is presented for removal. Straightforward access to the cutting units is afforded when the spring pack is removed. Risk of damage to various components of the lead forming system is minimized and the precision and accuracy of the new setup is increased because the system was minimally disassembled. A method for removing the spring pack in the upper die unit is fully disclosed.

A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

An improvement to a lead forming system that provides quick changeover without complete disassembly. By removing a pair of fasteners securing a pair of die inserts, a spring pack in an upper die unit can be freely rotated and interchanged or modified. The spring pack has a plurality of chamfers that allow the spring pack to rotate within the die pack until a narrower side is presented for removal. Straightforward access to the cutting units is afforded when the spring pack is removed. Risk of damage to various components of the lead forming system is minimized and the precision and accuracy of the new setup is increased because the system was minimally disassembled. A method for removing the spring pack in the upper die unit is fully disclosed.

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.

A cut and clinch device includes a movable section slidable with respect to a main body section. A first insertion hole is formed in main body section, and a second insertion hole is formed in the movable section. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. A recognition mark is provided on the movable section and the main body section, and the types of the movable section and the main body section are recognized based on image data of the recognition marks. By this, it is possible to appropriately check the type of the portion that cuts a lead.