Transfer material supply units for supplying a transfer material to a transfer table and spreading the transfer material is set in a component mounting machine, and transfer pins for transferring the transfer material to a mounting surface of a three-dimensional board are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface.

The present invention discloses an inter-layer transition forming machine for winding of a large-sized superconducting coil. A vertically movable forming mechanism and a horizontally movable forming mechanism are mounted on a fixing plate. When the winding of a large-sized superconducting coil performs inter-layer transition, an armored superconducting conductor is clamped by wedge clamping mechanisms with right- and left-handed threads on the vertically movable forming mechanism and the horizontally movable forming mechanism, and a reference line on the conductor is ensured to be aligned with a reference line on a forming mold. The vertically movable forming mechanism is pressed down, under the drive of a double-acting hydraulic cylinder, in a vertical direction to form inter-layer transition, and the horizontally movable forming mechanism moves in a horizontal direction according to the reduction of the vertically movable forming mechanism.

A component mounting program for mounting a component on a board, the component mounting program being configured to identify whether a component supplied from a tape feeder on the component mounting program is a component supplied from a sequential taped component or a component supplied from a taped component other than the sequential taped component.

A tape guide includes a guide section configured to guide a carrier tape, a component exposing section configured to open a cover tape to expose an electronic component in a component storage section during conveyance of the carrier tape guided by the guide section, a tongue portion provided on the component exposing section and configured such that a distal end portion is movable between a first height position at which the distal end portion enters between a base tape and the cover tape and a second height position higher than the first height position, a pressing section placed above the tongue portion to apply a pressing force to the tongue portion to cause the tongue portion to move downward, and a stepped portion provided on a facing surface on which the tongue portion and the pressing section face each other.

A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to simultaneously coordinate the movement of the gantry assembly and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit a predetermined distance and orientation from the electronic substrate while dispensing material along a three-dimensional path.

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

The control device of a tape feeder, during the loading processing, in a case in which carrier tape that is preadjusted such that a length from a first cavity, which houses the electronic component and which is first from the leading end of the carrier tape among the multiple cavities, to the leading end of the carrier tape is a regulated length is inserted into the insertion section, starts conveyance of the carrier tape and makes a position of the first cavity a specified position in the feeder main body in accordance with a detection result of the detection sensor.

The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.

A CPU box of each mounting machine module obtains MAC addresses of communication devices of both an internal device and a base by communicating with the communication devices of both the internal device and the base after the power is turned on, compares the obtained MAC address of the internal device side and the obtained MAC address of the base side, with storage data of the MAC addresses of both the internal device side and the base side read from a non-volatile storage medium of the CPU box, obtains management data of the mounting machine module stored in association with the MAC address of the internal device side from the non-volatile storage medium of a management computer in a case where the MAC address of the internal device side does not match the storage data, and obtains the management data of the mounting machine module stored in association with the MAC address of the base side from the non-volatile storage medium of the management computer in a case where the MAC address of the base side does not match the storage data.