Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

The present invention relates to detaching equipment for detaching an electronic device and a detaching method thereof. A base of the detaching equipment comprises a bearing groove for bearing the electronic device. The first fixing unit and the second fixing unit are disposed at the base. A fixing member of the first fixing unit is capable of moving along a first direction to fix a housing of the electronic device. A protruding portion of the fixing member faces the bearing groove. A baffle of the second fixing unit moves along a second direction to be inserted between a motherboard and a battery unit. At least one lifting portion of a pry bar is provided with an arc. The arc of the lifting portion fits the battery unit of the electronic device, and the pry bar abuts against the protruding portion to lift and detach the battery unit.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

A system and method are directed to a fan board sled assembly comprising a fan circuit board including a first end and an opposing second end, a fan cage module including a front section for receiving and removably securing the first end of the fan circuit board to the fan cage module, and a guide bracket including a base section for receiving and removably securing the second end of the fan circuit board to the guide bracket. The fan cage module further includes a back section for receiving one or more fan bodies. The combined fan circuit board, fan cage module and guide bracket are a single integrated unit insertable and extractable from a chassis opening of a computer chassis.

A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.