A reel holding device includes a first reel support member that includes a first placement member that rotatably supports a first reel and a second reel support member that supports a second reel. The first reel support member is rotatable between a reference position at which a carrier tape of the first reel is supplied to the mounter, and a discharge position for discharging the first reel. By rotating the first reel support member from the reference position toward the discharge position, the first reel drops through an opening of the first placement member and is discharged. When the first reel support member returns from the discharge position to the reference position, the second reel moves through the opening and into the interior of the first placement member.

The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

The present invention is an IC chip mounting apparatus including: an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; a nozzle movable between a first position and a second position, the nozzle being configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of each antenna, when located at the second position; a determination unit configured to determine whether an IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position; and a moving machine configured to move the nozzle away from the second position when it is determined by the determination unit that an IC chip is not sucked by the nozzle.

A component supply method of supplying components scattered on a stage, includes a storage step of storing position information indicating a position of a component, posture information indicating a posture of the component, and number information indicating the number of components based on imaging data of the components scattered on the stage, and a holding step of holding the components scattered on the stage with a holding tool based on the position information and the posture information stored in the storage step.

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

An electronic expansion valve and a manufacturing method therefor, a thermal management assembly and a cooling system are provided. The electronic expansion valve includes a valve core assembly, an electronic control part and a stator assembly. The valve core assembly includes a valve base, a valve core and a rotor assembly, wherein the valve base is provided with a valve port, and the valve core moves relative to the valve base to change the degree of opening of the valve port. The electronic control part controls the stator assembly, and the rotor assembly drives the valve core to move. The electronic expansion valve further includes a sensor, the electronic control part includes an electronic control board, and the stator assembly and the sensor are both directly electrically connected to the electronic control board. The thermal management assembly and the cooling system both include the electronic expansion valve.

An electronic expansion valve and a manufacturing method therefor, a thermal management assembly and a cooling system are provided. The electronic expansion valve includes a valve core assembly, an electronic control part and a stator assembly. The valve core assembly includes a valve base, a valve core and a rotor assembly, wherein the valve base is provided with a valve port, and the valve core moves relative to the valve base to change the degree of opening of the valve port. The electronic control part controls the stator assembly, and the rotor assembly drives the valve core to move. The electronic expansion valve further includes a sensor, the electronic control part includes an electronic control board, and the stator assembly and the sensor are both directly electrically connected to the electronic control board. The thermal management assembly and the cooling system both include the electronic expansion valve.

A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.

A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.

It is an object of the present invention to provide a production system and a control method for the production system that can suppress erroneous mounting when a tape feeder is shared and used even when latest tape feeder information is not shared among multiple production lines in a production system having multiple production lines. Information that matches the tape feeder database stored by the line management device is stored in the tape feeder. When the tape feeder is mounted on the mounting machine, the information stored in the tape feeder is read, and when it is determined that the information does not match the tape feeder database, mounting of the electronic component supplied from the tape feeder is stopped.