A processing station automatically manufactures a cable harness containing a plurality of individual lines. The processing station has a support unit for holding a line bundle containing the individual lines with a predefined, even branched, routing, and a processing unit for the automated fixing of the individual lines of the line bundle to one another. The processing unit has a fixing unit, which is configured for the automated application of a fixing agent to the line bundle. A manipulator is provided for moving the processing unit relative to the line bundle.

A flexible laminate (1) includes an electrically non-conductive substrate (2) with a substantially planar configuration, an electrically conductive element (3) on a surface of the electrically non-conductive substrate, and a layer (4) on a surface of the electrically non-conductive substrate (2). The electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) are coaxially punctured forming a punctured region (6). They are connected to each other through a mechanical connection element (5) which extends through the electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) at the punctured region (6). The cross-sectional area of the electrically conductive element (3) at the location of the punctured region (6) is larger than the cross-sectional area of the electrically conductive element (3) outside the punctured region (6).

A flexible laminate (1) includes an electrically non-conductive substrate (2) with a substantially planar configuration, an electrically conductive element (3) on a surface of the electrically non-conductive substrate, and a layer (4) on a surface of the electrically non-conductive substrate (2). The electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) are coaxially punctured forming a punctured region (6). They are connected to each other through a mechanical connection element (5) which extends through the electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) at the punctured region (6). The cross-sectional area of the electrically conductive element (3) at the location of the punctured region (6) is larger than the cross-sectional area of the electrically conductive element (3) outside the punctured region (6).

A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.

A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

A component of an ion optical device is manufactured. The component comprises aligned first and second electrode sets. A first material is machined to provide a part-machined first electrode set that comprises the first electrode set attached to a frame part of the first material. A second material is machined to provide a part-machined second electrode set that comprises the second electrode set attached to a frame part of the second material. The component of the ion optical device is assembled by aligning the part-machined first and second electrode sets. Subsequent to aligning the part-machined first and second electrode sets, the part-machined first electrode set is further machined to separate the first electrode set from the frame part of the first material and the part-machined second electrode set is further machined to separate the second electrode set from the frame part of the second material.

According to an aspect of the present disclosure, a device for manufacturing a side line includes a stage on which a substrate is loaded, a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage, and a printing unit configured to print a conductive paste on the substrate.

According to an aspect of the present disclosure, a device for manufacturing a side line includes a stage on which a substrate is loaded, a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage, and a printing unit configured to print a conductive paste on the substrate.