The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.

A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

There is provided a component feeding device including multiple component replenishing devices configured to replenish with components having different shapes; multiple stages on which the components replenished from the multiple replenishing devices are scattered, and a control section configured to cause the multiple replenishing devices to replenish the components to the respective stages at an arbitrary timing. There is provided a component feeding method for supplying components, having different shapes and being respectively replenished onto multiple stages from multiple replenishing devices, to a component mounting device with the components being respectively scattered on the multiple stages, wherein amounts of the components is capable of being respectively changed for each of the multiple stages.

A power control system includes electronic component mounting apparatuses; power control modules configured to control power of the electronic component mounting apparatuses; a power controller configured to turn on and off the power of the electronic component mounting apparatuses by controlling the power control modules, or receive signals from the power control modules indicating power on and off states of the electronic component mounting apparatuses; and a remote control module that is remote from the electronic component mounting apparatuses and is configured to control the power of electronic component mounting apparatuses by controlling the power controller via a wired or wireless connection.

A power control system includes electronic component mounting apparatuses; power control modules configured to control power of the electronic component mounting apparatuses; a power controller configured to turn on and off the power of the electronic component mounting apparatuses by controlling the power control modules, or receive signals from the power control modules indicating power on and off states of the electronic component mounting apparatuses; and a remote control module that is remote from the electronic component mounting apparatuses and is configured to control the power of electronic component mounting apparatuses by controlling the power controller via a wired or wireless connection.

A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.

There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.

A substrate manufacturing machine (component mounter) includes a substrate type setting section configured to set next and subsequent substrate types to be manufactured subsequently to a current substrate type currently being manufactured, a substrate type checking section configured to check whether the set next and subsequent substrate types are correct, a manufacturing condition investigation section configured to examine whether a manufacturing condition for manufacturing substrates of the next and subsequent substrate types is satisfied, and a manufacturing authorization section configured to authorize manufacturing of the substrates of the next and subsequent substrate types in a case where the next and subsequent substrate types are correct and the manufacturing condition is satisfied.