An article transport system includes a station group, a first communication device, and a determination section. In the station group, multiple stations capable of sending out and receiving an article, which is used in a board work machine performing a predetermined board work on a board, are arranged side by side. The first communication device includes a first communication section, which is provided in a transport vehicle capable of sending out and receiving the article between the transport vehicle and a predetermined station among the multiple stations, and a second communication section, which is provided in each of the multiple stations.

A pre-calibrated spray plane image acquisition device is described that includes, in a single fixed-form structure, both an image capture component configured to acquire an optical image of a field of view and a light plane generator configured to generate a planar light plane emitted from the pre-calibrated spray plane image acquisition device. A carrier frame structure includes rigid components for permanently maintaining the image capture component and the light plane generator in respective positions defining a permanent spatial relationship between the field of view of the image capture component and the light plane generated by the light plane generator.

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

A component mounting program for mounting a component on a board, the component mounting program being configured to identify whether a component supplied from a tape feeder on the component mounting program is a component supplied from a sequential taped component or a component supplied from a taped component other than the sequential taped component.

A component supply unit set-up system includes a container warehouse configured to store multiple component containers for containing multiple components, a unit storage shed configured to store multiple component supply units used when the component, which is contained in the component container, is supplied in a mounting operation performed by a component mounter, a work table disposed between the container warehouse and the unit storage shed and used for a loading operation of loading the component supply unit with the component container , a container conveyance robot configured to convey the component container between the container warehouse and the work table, and a unit conveyance robot configured to convey the component supply unit between the unit storage shed and the work table.

A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to simultaneously coordinate the movement of the gantry assembly and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit a predetermined distance and orientation from the electronic substrate while dispensing material along a three-dimensional path.

Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

The control device of a tape feeder, during the loading processing, in a case in which carrier tape that is preadjusted such that a length from a first cavity, which houses the electronic component and which is first from the leading end of the carrier tape among the multiple cavities, to the leading end of the carrier tape is a regulated length is inserted into the insertion section, starts conveyance of the carrier tape and makes a position of the first cavity a specified position in the feeder main body in accordance with a detection result of the detection sensor.

A storage unit includes an accumulation structure defined by a plurality of vertical walls having a plurality of guides arranged horizontally and configured to support a plurality of trays. In each tray there is at least one shaped housing that accommodates at least one object and on the sides of the tray there are shaped edges configured to be slidingly coupled with the guides when the tray is inserted between two consecutive vertical walls. Each tray is configured so as to receive on its upper surface one or more spacer elements that can be superimposed to one another and to the upper surface and connected to one another and to the upper surface through removable connections in order to vary the depth of the shaped housing. Movers are provided that are suited to move the trays with the objects arranged thereon and to insert/extract the trays in/from the guides.

The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.