An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.

An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.

A circuit board assembly for retrofitting a circuit board on a power drive unit (PDU) may comprise an enclosure, a circuit board disposed in the enclosure, and a potting component disposed in the enclosure. The circuit board assembly may further comprise a dielectric sheet and a backing sheet. The dielectric sheet may be disposed between the backing sheet and the printed circuit board assembly.

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO.sub.2; greater than 18.0 weight percent B.sub.2O.sub.3 and no more than 26.0 weight percent B.sub.2O.sub.3; greater than 16.0 weight percent Al.sub.2O.sub.3 and no more than 23.0 weight percent Al.sub.2O.sub.3; between 0.25 to 12.0 weight percent P.sub.2O.sub.5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe.sub.2O.sub.3; and less than 0.50 weight percent TiO.sub.2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO.sub.2; greater than 18.0 weight percent B.sub.2O.sub.3 and no more than 26.0 weight percent B.sub.2O.sub.3; greater than 16.0 weight percent AI.sub.2O.sub.3 and no more than 23.0 weight percent AI.sub.2O.sub.3; between 0.25 to 12.0 weight percent P.sub.2O.sub.5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe.sub.2O.sub.3; and less than 0.50 weight percent TiO.sub.2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.