A coreless component carrier includes (a) a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a component embedded in the stack. At least one electrically insulating layer structure includes a reinforced layer structure, which is arranged at an outer main surface of the stack. Further described is a method for manufacturing such a coreless component carrier and preferably simultaneously a further coreless component carrier of the same type.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

A circuit formation method includes a wiring formation step of forming a wiring by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and firing the metal-containing liquid, a paste application step of applying a resin paste containing micrometer-sized metal particles to be connected to the wiring formed in the wiring formation step, and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied in the paste application step.

The invention relates to a process of fabricating a beaded path on the surface of a substrate, the process comprising: preparing a dispersion of particles in a liquid; supplying the prepared dispersion to at least one electrically conductive microcapillary in a continuous manner; forming and maintaining a convex meniscus of the dispersion at the outlet end of the microcapillary positioned above and/or below the surface of a substrate; applying alternating voltage to the microcapillary so that a beaded structure is formed between the dispersion meniscus and the surface of the substrate; and moving the microcapillary relative to the substrate and/or the substrate relative to the microcapillary so as to deposit the particles of the formed beaded structure on the surface of the substrate and simultaneously rebuild the beaded structure formed between the dispersion meniscus and the surface of a substrate. The invention also relates to a system for realizing this process and the use of the beaded path fabricated in accordance with the process of the invention for the production of electrodes in photovoltaic cells, new generation clothing, electronic components, including flexible electronics, artificial flagella, photonic and optomechanical materials, as well as for the regeneration of damaged paths on the surface of a substrate. The present invention also relates to a kit comprising a substrate and a beaded path fabricated on the surface of that substrate according to this process. The invented process is simple, efficient, hence economical, and enables fabricating beaded paths that retain their properties after turning off the voltage initially used to form a beaded structure. Moreover, the process occurs outside a liquid environment and enables fabricating of paths in a continuous manner, that is, through the formation of the beaded structure and its simultaneous depositing on the surface of a substrate allowing the fabrication of beaded paths of arbitrary length.

An insulating paste of the present invention contains an elastomer composition containing silica particles (C) and a solvent.

A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

A thermosetting resin composition and a printed circuit board including the same are provided. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjusting heat resistance, fluidity, and filling property. A particle diameter of 1 m to 40 m is added to control a dielectric constant, and after curing characteristics of high dielectric constant, low dielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.