Provided is a novel resin composition for a metal-clad laminate, with which a metal-clad laminate having excellent adhesion with a metal foil, solder heat resistance, insulation and the like can be produced. A terminally modified polybutadiene contained in the resin composition for a metal-clad laminate according to the present invention has a structure of formula (III) on each of both terminals of a polybutadiene comprising a repeating unit of formula (I) and a repeating unit of formula (II), wherein a proportion of the repeating unit of formula (I) in all the repeating units is 70 to 99% by mol.

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Printed wiring board manufacturing method, and printed wiring board. The method includes preparing sheet material including cloth-like material woven of reinforced fiber with a 90 degree between warp thread and a weft thread; arranging the sheet material on a cutting-out apparatus so that the sheet material is tilted 5 to 30 degrees with respect to threads configuring the cloth-like material and cutting a portion to cross the cloth-like-material configuration threads aligned on a cutting blade at 5 to 30 degrees; cutting the sheet material from the tilted sheet material with the cut portion crossing the cloth-like-material configuration threads aligned on the cutting blade to form the sheet material with a circumferential edge of the sheet material crossing the cloth-like material configuration threads at 5 to 30 degrees; creating a mother laminate configured with the sheet material as an inner-layer board or an insulating board; and providing a conductor pattern on a metal layer of the mother laminate along a circumferential edge portion of the mother laminate.

The present disclosure provides circuit structure configured to decrease a phase difference between a first signal and a second signal. The circuit structure includes substrate. The substrate includes a first conductive layer, a first woven dielectric layer, and a second woven dielectric layer. The first conductive layer is disposed over the substrate. The first conductive layer includes a circuit pattern configured to transmit the first signal and the second signal. The first woven dielectric layer is stacked below the first conductive layer. The first woven dielectric layer has a plurality of first opens. The second woven dielectric layer is stacked below the first woven dielectric layer. The second woven dielectric layer has a plurality of second opens. The plurality of first opens and the plurality of second opens are misaligned from a top view.

Disclosed is a preparation method for a copper clad laminate comprising: (1) dissolving a polymer in an organic solvent, heating and stirring to obtain a pre-impregnation liquid; (2) impregnating a liquid crystal polymer cloth in the pre-impregnation liquid, and drying to obtain a liquid crystal polymer impregnated cloth; and (3) laminating the liquid crystal polymer impregnated cloth and a copper foil to prepare the copper clad laminate, wherein the polymer in step (1) is at least one selected from the group consisting of fully aromatic polyesteramide, epoxy resin, and polyimide; and the liquid crystal polymer cloth in step (2) is prepared from a liquid crystal polymer having a melting point greater than 280° C., a dielectric constant less than 3.2, and a dielectric loss tangent angle less than 0.0025. The preparation method for the copper clad laminate has a simple preparation process and a low manufacturing cost.

A printed board includes a first and second insulator extending in a first direction; a third insulator extending in a second direction and including a first and second portion located above and below the first insulator respectively in a third direction; a fourth insulator extending in the second direction, and including a third and fourth portion located below and above the first insulator respectively in the third direction; and a first and second conductor extending in the first direction, and arranged along the second direction with a first pitch therebetween. The first pitch is an n multiple of a first distance that is based on an interval between the first and second portion or the third and fourth portion. The n is an integer equal to or greater than 1.

To provide a flexible conductive base member and a multilayer conductive base member including the same, having no problem of failing to function as a contact and causing a variation in height between contacts.

There are a covered region 10 covered with a noble metal and a non-covered region 20 not circumferentially covered with a noble metal on a surface of a reticulated fibrous body 50. The covered region 10 is located at an intersection 7 of fibers 5 of the reticulated fibrous body 50, and the intersections 7 are connected to each other. The non-covered region 20 is located between the intersections 7 of the fibers 5 of the reticulated fibrous body 50.

The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.

The present invention discloses an terminal worn by athletes. The terminal comprises an wrist sleeve portion formed of one or more layers, an plurality of input buttons disposed on its exterior surface and an plurality of smartphone and micro-components coupled to the one or more interior layers. The terminal comprises an display assembly disposed on a exterior layer of the wrist sleeve portion exterior surface configured to display one or more objects via an display. The terminal also comprises an flap assembly coupled to the display assembly, the flap assembly comprises an sack portion which hold an play-card or similar object and a pull-tab which allocates an user to separate the flap assembly from the display assembly. The current invention also discloses a method for determining an location of a object and executing an function of the object based upon an user interaction. The method consisting of moving an object from a first location to a second location and a input circuitry determining a row signal strength and a processor executing the object function on a second user interface based upon a second obtained signal strength.

An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
0.12<{(a1+a2)/2}/B  (1)
0.8≤a1/a2≤1.25  (2)