H05K2201/0326

Sensor and sensor-equipped display device

A sensor is provided and includes a first control line; a first signal line; a first auxiliary line; a first detection electrode; a first detection switch connected to the first detection electrode, the first control line and the first signal line; and a first shielding electrode connected to the first auxiliary line, wherein the first shielding electrode is located to overlap the first signal line via an insulating film.

SUBSTRATE PROVIDED WITH TRANSPARENT CONDUCTIVE FILM
20180007786 · 2018-01-04 ·

Provided is a transparent conductive film-equipped substrate that makes it difficult for an insulating film provided on a portion from which a transparent conductive film has been removed to peel off. The transparent conductive film-equipped substrate 10 includes a substrate 1 and a transparent conductive film 2 provided on the substrate 1 and subjected to patterning, wherein the transparent conductive film-equipped substrate is made up so that: a removal region A1 where the transparent conductive film 2 has been removed by patterning, a non-removal region A2 where the transparent conductive film is left unremoved, and a boundary region A3 provided between the removal region A1 and the non-removal region A2 are formed on the substrate 1; and the boundary region A3 is formed with insular portions 2b in which the transparent conductive film 2 is formed in insular shapes.

LAMINATED STRUCTURE FOR THERMAL CONDUCTION IN A FLEXIBLE ELECTRICAL SUBSTRATE
20230221348 · 2023-07-13 · ·

A structure has a flexible thermally conductive material having an adhesive surface and a non-adhesive surface, and a thermally conductive adhesive adhered to the adhesive surface of the flexible thermally conductive material leaving the non-adhesive surface exposed to an atmosphere in which the structure resides. A structure has a substrate having one or more conductive paths, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the conductive paths. An apparatus has a substrate having one or more conductive paths, a probe tip at one end of the substrate configured to electronically connect with a device under test, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the probe tip and conductive paths.

CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Drive backboard, manufacturing method thereof and backlight module

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

Micro-fabricated electrode arrays with flexible substrate for highly charge-efficient and selective stimulation of nerve tissue

A method and apparatus of electrode interfaces for stimulating neurons and nerve cells that provides micro-fabricated electrode interfaces configured for conformal placement adjacent to neuron, nerves and neural tissue to thereby allow the neuron, nerves and neural tissue to grow around the electrode interfaces and allow for the creation depending on configuration of local or far electrical fields and current flows to stimulate them.

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
20230119587 · 2023-04-20 · ·

An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.

One-Step Oxide Bath for Improving Adhesion of Polymeric Materials to Metal Substrates

An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;

Conductive pattern laminate and electronic device comprising same

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.

Continuous interconnects between heterogeneous materials

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.