Patent classifications
H05K2201/0329
Touch panel and method for manufacturing the same
A touch panel includes: a uni-axially oriented base film; a transparent electrode pattern layer positioned on the uni-axially oriented base film; a first passivation layer formed in an edge region of the transparent electrode pattern layer and covering end portion side walls of the transparent electrode pattern layer; and a contact hole positioned on the first passivation layer and exposing the first passivation layer.
Transparent conductive laminate, transparent electrode including transparent conductive laminate, and method for manufacturing transparent conductive laminate
Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.
Molded Interconnect Device
A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.
Electrode and device for detecting biosignal and method of using the same
An electrode, a biosignal detecting device and a method of measuring a biosignal are provided. The electrode includes an ion conductive member configured to be attached to a body surface, a nonconductive member including a through hole and disposed on the ion conductive member, a conductive member disposed on the nonconductive member, and a nonpolarizable conductive member configured to electrically couple the ion conductive member to the conductive member.
CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD
A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.
WOUND TREATMENT PATCH USING STATIC ELECTRICITY AND METHOD FOR FABRICATING THE PATCH
Disclosed are a wound treatment patch using static electricity, and a method for fabricating the wound treatment patch using static electricity. The patch includes a substrate made of a sticky polymer; a first electrode disposed in a first partial region of one face of the substrate and exposed to an outside; and a second electrode disposed in a second partial region other than the first partial region, and spaced apart from the first electrode, and encapsulated within the substrate, wherein each of the first electrode and the second electrode is made of hydrogel having electrical conductivity or a soft polymer having electrical conductivity.
Molded interconnect device
A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.
Bidirectional self-healing neural interface
A bidirectional self-healing neural interface includes a first elastic substrate; a neural electrode disposed on the first elastic substrate and comprising a conductive polymer composite; and a second elastic substrate disposed on the neural electrode. The conductive polymer composite includes a matrix formed of a self-healing polymer material; and a plurality of electrical conductor clusters distributed in the matrix. Each of the electrical conductor clusters includes particles of a first electrical conductor; and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor, and having sizes that are smaller than those of the particles of the first electrical conductor. The first electrical conductor is a source for generating the second electrical conductor. The neural interface has excellent elasticity, electrical conductivity that is improved by deformation, and is self-healing.
Method of creating a flexible circuit
According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.
Stretchable electronic device
A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.