A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.

A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of

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in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,

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Each of R.sup.3 is independently

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Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.

An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.

A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, insulating through holes, a signal transmission layer and a polymer conductive member. The ground layer is disposed between the insulating layer and the insulating substrate layer. The signal transmission layer is disposed on one side of the insulating layer opposite to the ground layer. The insulating through holes penetrate through the signal transmission layer and the insulation layer to connect to the ground layer. The polymer conductive member is disposed within the insulating through holes, and one part thereof is electrically connected to the ground layer, and another part thereof extends outwards from the signal transmission layer.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

A method for making a conductive polymer for electromagnetic shielding purposes includes steps of mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent in certain proportions by weight to form a mixture. A solvent is added into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight. The mixture is heated to undergo an atom transfer radical polymerization.

A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

To improve the characteristics of a compound adapted to create inside an electrically conductive track or area, the compound comprising a solvent, a polymer with double covalent conjugate bond, namely a heterocyclic compound formed by n carbon atoms and one atom of a different type linked in a ring structure; and a dispersion of conductive particles, there is added an agent adapted to slow down the precipitation of the conductive particles within the material.