Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.

The invention relates to a multi-layer 3D foil package and to a method for manufacturing such a multi-layer 3D foil package. The 3D foil package has a foil substrate stack having at least two foil planes, wherein a first electrically insulating foil substrate is arranged in a first foil plane, and wherein a second electrically insulating foil substrate is arranged in a second foil plane, wherein the first foil substrate has a first main surface region on which at least one functional electronic component is arranged, wherein the second foil substrate has a cavity having at least one opening in the second main surface region, wherein the foil substrates within the foil substrate stack are arranged one above the other such that the functional electronic component arranged on the first foil substrate is arranged within the cavity provided in the second foil substrate.

This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.

A packaging process for embedded chips includes: (1) mounting at least one IC chip on a circuit substrate, the IC chip having at least one exposed pin; (2) attaching a self-adhesive copper foil film to the surface of the circuit substrate, wherein the self-adhesive copper foil film has a copper foil layer and a B-stage insulating adhesive layer, the copper foil layer has at least one to-be-opened copper foil area corresponding to the pin, the insulating adhesive layer is applied on the copper foil layer, has no glass fiber, covers the IC chip, and has at least one to-be-opened insulating adhesive area corresponding to the pin, and the pin is in contact with the insulating adhesive layer but not with the copper foil layer; (3) removing the to-be-opened copper foil area; (4) removing the to-be-opened insulating adhesive area with an etching solution; and (5) curing the insulating adhesive layer completely.

A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.

The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

A reel mechanism and a winding device for a flexible copper clad laminate includes a rotating roller, a winding belt wound on the rotating roller for winding the flexible copper clad laminate, first and second limit structures arranged one side of the winding belt away from the rotating roller. A space between the first limit structures and the second limit structures accommodates the flexible copper clad laminate. When the winding belt is wound with multiple layers outside the rotating roller, adjacent layers of the winding belt are spaced apart by the first and second limit structures. Since a protruding height of the first limit structures is equal to a protruding height of the second limit structures, and intervals between adjacent layers of a composite coil formed by the winding belt and the flexible copper clad laminate are equal, which avoids adhesion and copper foil surface oxidation.