A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.

Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.

The present disclosure relates to a display device capable of preventing light-emitting elements in a display panel from being deteriorated. A power supply circuit includes a plurality of first power supply lines each of which extends in a first direction and a plurality of second power supply lines each of which extends in a second direction intersecting the first direction, in which the second power supply lines are electrically connected with the first power supply lines.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board seated inside the housing, and a second printed circuit board seated inside the housing such that a height of the second printed circuit board from the second surface is different from that of the first printed circuit board, wherein the first printed circuit board includes a mounting part on which at least one component is mounted, a first connector which extends from a first part of the mounting part. A portion of the first connector being substantially perpendicular to the mounting part and configured to be connected to the second printed circuit board, and a second connector which extends from a second part of the mounting part and configured to be connected to the second printed circuit board.

An electronic device is provided. The electronic device includes a housing that includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface, a first printed circuit board seated inside the housing, a second printed circuit board seated inside the housing, a plurality of cables configured to electrically connect the first printed circuit board and the second printed circuit board, and at least one cable fixing apparatus coupled to the first printed circuit board or the second printed circuit board to accommodate and fix the plurality of cables. In addition, various embodiments identified through the specification are possible.

Electrical input devices, conductive traces, and microcontroller interface devices can be created in a single print using a multi-material 3D printing process. The devices can include a non-conductive material portion and a conductive material portion. The non-conductive and conductive material portions are integrally formed during a single 3D printing process. For example, a fully functional QWERTY keyboard, ready to receive a microcontroller, can be multi-material 3D printed using the techniques described herein.

An electronic device is provided. The electronic device includes a housing that includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface, a first printed circuit board seated inside the housing, a second printed circuit board seated inside the housing, a plurality of cables configured to electrically connect the first printed circuit board and the second printed circuit board, and at least one cable fixing apparatus coupled to the first printed circuit board or the second printed circuit board to accommodate and fix the plurality of cables. In addition, various embodiments identified through the specification are possible.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.