Patent classifications
H05K2201/052
SENSOR MOUNTED WAFER
The present invention provides a sensor mounted wafer, including: a lower case in which a mounting groove is formed; a circuit board on which a plurality of electronic components having different heights are mounted, and placed in the mounting groove; an upper case in which a plurality of insertion grooves having different depths are formed, and bonded together to the lower case so that the plurality of electronic components are inserted into the plurality of insertion grooves; and an adhesive layer placed between the mounting groove and the plurality of insertion grooves, in which the insertion grooves are formed to have different depths according to the heights of the plurality of the electronic components.
WIRING MODULE
A wiring module includes a first flexible printed circuit and a second flexible printed circuit that is separate from the first flexible printed circuit. The first flexible printed circuit and the second flexible printed circuit are arranged so as to be continuous in a first direction and are shaped as a band that extends in the first direction. A connector is mounted to each of the first flexible printed circuit and the second flexible printed circuit. The fitting direction in which the connector mounted to the first flexible printed circuit is fitted to a partner connector is different from the fitting direction in which the connector mounted to the second flexible printed circuit is fitted to a partner connector.
FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member may include a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate.
Electronic device including multiple printed circuit boards
An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.
DISPLAY APPARATUS AND ELECTRONIC DEVICE
A display apparatus and an electronic device. The display apparatus includes a flexible display panel, a plurality of driver integrated circuits, a logic board, and a circuit board. The driver integrated circuits are disposed on a first surface of the flexible display panel and on a peripheral region; and the circuit boards is electrically connected to the driver integrated circuits and the logic board, respectively. A first bendable section of the circuit board is configured to be bent to a second surface of the flexible display panel along a first side edge; a second bendable section of the circuit board is configured to be bent at a side where the second surface is disposed, such that the logic board protrudes from the first side edge; and a third bendable section of the circuit board is configured to bypass a hinge shaft of the electronic device.
INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.
BUSBAR MODULE
A busbar module includes: a plurality of busbars arranged along a first direction and connected to battery cells; and a plate-like circuit body having a plurality of detection lines to be connected to the busbars and having flexibility, in which the circuit body includes a main line portion in which the plurality of detection lines is routed and branch portions, branching from the main line portion and in which the detection lines to be connected to the busbars are routed, the branch portions each include a stretchable portion that is stretchable along the first direction, the stretchable portions each have slits or a cutout formed in a direction intersecting the first direction in a plan view of the circuit body, and a detection line of each of the stretchable portions is routed along the slits or the cutout.
FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD, MOVABLE APPARATUS, AND ELECTRONIC DEVICE
A flexible circuit board includes a main board, a first connecting plate, and a second connecting plate; a side surface of the first connecting plate is connected to a first side surface of the main board, and an included angle between the main board and the first connecting plate is a first preset angle; a side surface of the second connecting plate is connected to the first side surface of the main board, and an included angle between the main board and the second connecting plate is a second preset angle; and the first preset angle and the second preset angle are both greater than 0 degree and less than 180 degrees.
Integral features providing improved flexible printed circuit folding and connection capability
A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.
Electromagnet coils made from flexible circuits
A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB.