Patent classifications
H05K2201/053
WIRING MODULE
A wiring module includes a first flexible printed circuit and a second flexible printed circuit that is separate from the first flexible printed circuit. The first flexible printed circuit and the second flexible printed circuit are arranged so as to be continuous in a first direction and are shaped as a band that extends in the first direction. A connector is mounted to each of the first flexible printed circuit and the second flexible printed circuit. The fitting direction in which the connector mounted to the first flexible printed circuit is fitted to a partner connector is different from the fitting direction in which the connector mounted to the second flexible printed circuit is fitted to a partner connector.
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER DEVICES
Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.
FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT
A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.
LED LIGHT STRIP SUBSTRATE, LED LIGHT STRIP AND TERMINAL DEVICE
An LED light strip substrate, an LED light strip and a terminal device are provided. The LED light strip substrate includes: a body region and peninsula regions; the peninsula regions are spaced apart along the edge of the body region and can bend so as to form a predetermined angle with the body region, the peninsula regions are configured to be provided with an LED flip chip; and the body region is provided with a circuit used for connecting the LED flip chip.
Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus
This invention provides an electro-optical module with reduced noise in driving voltage. The invention can include a power supply substrate that is arranged separately from the flexible substrate having a driver, so that the noise of the driving voltage supplied from the power supply substrate is reduced. The electro-optical module includes a first connecting portion connecting a first end of the flexible substrate to a display panel and configured to receive a signal from the driver, and a second connecting portion connecting the first end of the flexible substrate to the display panel and configured to receive the driving voltage from a third connecting portion at a second end of the flexible substrate.
BUSBAR MODULE
A busbar module includes: busbars that are fixed to battery cells of a battery module; a plate-like flexible circuit body that includes conductors corresponding to the busbars; and a case that accommodates the circuit body and the busbars, in which the circuit body includes a trunk portion and a branch portion connected to the busbar, the branch portion includes a base layer, a metal foil that is the connection conductor, and a coating layer that covers the base layer and the metal foil, the branch portion has a facing portion faces a first surface of the busbar, the metal foil is connected to a connection target at a portion that is more adjacent to a distal end than the facing portion is, and the first surface has a groove-shaped recess provided at a portion facing the metal foil.
BUSBAR MODULE
A busbar module includes: a plurality of busbars that are fixed to a plurality of battery cells of a battery module including the plurality of battery cells; and a plate-like flexible circuit body that includes a plurality of connection conductors corresponding to the plurality of busbars, in which the circuit body includes a trunk portion extending in a first direction in which the plurality of battery cells are arranged, and a plurality of branch portions branching from the trunk portion and connected to the busbars, the circuit body includes a first circuit layer and a second circuit layer, and the branch portion has a thin portion composed of any one of the first circuit layer and the second circuit layer, and connects the trunk portion and the busbar in a state where the thin portion is flexurally deformed.
ANTENNA PACKAGE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME
An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.
Electronic Devices Having Folded Antenna Modules
An electronic device may be provided with a conductive housing sidewall and a phased antenna array that conveys radio-frequency signals at frequencies greater than 10 GHz. Each antenna in the array may radiate through a respective aperture in the sidewall. The antenna module may include a folded flexible printed circuit having a first portion and a second portion that extends from an end of the first portion and that is folded with respect to the first portion. The antennas in the phased antenna array may have antenna resonating elements that are distributed between the first and second portions. Forming the antenna module from a folded flexible printed circuit in this way may serve to minimize the thickness of the antenna module, thereby allowing the antenna module to fit between a ledge of the sidewall and a rear housing wall without occupying excessive space within the device.
SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF
This invention discloses a simplified pen core module and the preparation method thereof. The pen core module is characterized in that it adopts PCB board as the main body of pen core, and the PCB board is covered with FPC boards that serve as pins; a hollow threaded seat is sleeved at the strip part of the PCB board, and is electrically connected with and fixed at the root step of the strip part; a hollow metal cylinder and a hollow cone part are sleeved in sequence at the relative position of the strip part of the PCB board and, through the hollow interior thereof, electrically connected with the bonding pad of the PCB board and fixed at the relative position; a heat resisting insulation ring is sleeved between every two of the threaded seat, metal cylinder and cone part.