The proposed invention relates to a camera module with an optical image stabilization function. A flexible printed circuit board (FPCB) electrically connected to an image sensor is implemented to serve as an electrical path and at the same time, serve to provide an elastic restoring force in directions of a plurality of axes, thereby further miniaturizing and lightening the camera module.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

A display device includes: a flexible substrate including a display unit and a plurality of peripheral units which surrounds the display unit and are bent to overlap a part of the display unit; a display member positioned at the display unit and which displays an image; and a signal line positioned at the plurality of peripheral units, where the plurality of peripheral units is bent in a way such that parts of the signal line, which are respectively positioned at adjacent peripheral units, are in contact with each other.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

A display panel, a circuit board and a display device are provided, belonging to the field of displays. The display panel has a display region and a binding region which is at least on one side of the display region, and the display panel includes: a substrate; a plurality of signal pins on the substrate and in the binding region, the signal pins being arranged at intervals in a first direction and being connected to the circuit board; and at least one non-signal pin on the substrate and between two adjacent signal pins.

A bending apparatus includes a fixing structure, a first driving mechanism, a first pressing head connected to the first driving mechanism, a second driving mechanism and a second pressing head connected to the second driving mechanism. The first driving mechanism is configured to drive the first pressing head to move onto a first surface of a first portion, and to drive the first pressing head to push the first portion to rotate to a first side of a body portion, so that the first portion is parallel or substantially parallel to the body portion. The second driving mechanism is configured to drive the second pressing head to move onto a second surface of a second portion, and is further configured to drive the second pressing head to pull the second portion to rotate to the first side of the body portion while the first pressing head pushes the first portion.

An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.

In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.

A wireless communication device includes a base sheet in a folded state, a first conductor pattern disposed on a first principal surface of the base sheet, a second conductor pattern disposed on a second principal surface of the base sheet opposite to the first principal surface, an RFIC chip disposed on the base sheet so as to electrically connect to the first conductor pattern, and a sheet-shaped connection conductor coupled to a turning part of the base sheet so as to partially overlap with an end portion of the first conductor pattern near the turning part and an end portion of the second conductor pattern near the turning part.

A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.