The disclosure provides a portable light. The portable light includes a housing having a front surface, a rear surface, and an internal space for receiving electronic components and a battery. The portable light also includes a chip-on-board (COB) assembly. The COB assembly includes a substrate, a matrix of individual light emitting diode (LED) chips mounted to the substrate, and an outer coating covering the matrix of LED chips. The front surface of the housing is curved in one direction and the COB assembly is correspondingly curved and mounted to the front surface, such that individual LED chips are positioned about the curve and orientated to direct light outwardly about the curve to provide a collective beam angle greater than 220 degrees. The portable light further includes a front lens cover to protect the COB assembly.

The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.

An apparatus includes a first circuit board, a driving chip, and a second circuit board. The driving chip is coupled to the first circuit board, and the second circuit board is spaced apart from and electrically connected to the driving chip. At least part of the second circuit board is spaced apart from a first surface of the first circuit board.

A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.

An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

A display device including: a display panel; a first force sensor disposed under the display panel; and a waterproofing member disposed under the display panel and disposed adjacent to the first force sensor, a part of the first force sensor and a part of the waterproofing member overlap each other in a height direction of the display panel.

A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.

A sensor unit for vehicles for detecting at least the moisture and/or the temperature on the inside of a vehicle window by a sensor is disclosed. The sensor unit is mounted adjacent to the inside of the vehicle window, the sensor unit comprises a housing within which it is partially enclosed, the housing has at least one opening in the direction of the vehicle window through which the sensor unit is pressed against the vehicle window. The sensor unit has a printed circuit board (PCB) that is pressed against the inside of the vehicle window when the sensor unit is in the mounted state, and is arranged between the sensor and the vehicle window. The PCB is a rigid-flexible PCB comprising a bend at least in a partial region, the bend of the rigid-flexible PCB being set up in such a way as to generate an elastic restoring force, which presses the rigid-flexible PCB against the vehicle window. The rigid-flexible PCB has at least one recess for receiving a fixing means and these together are designed to hold the rigid-flexible PCB in a specific shape.

A wireless communication system includes a first differential signal line, a differential coupler, and an electronic circuit. The differential coupler has a second differential signal line to perform wireless communication of a differential signal with the first differential signal line via electromagnetic field coupling. The electronic circuit is connected to the differential coupler via a wired transmission path to process the differential signal. A surface of a board or a ground pattern of the electronic circuit is inclined or upright with respect to the second differential signal line so as to separate away from a direction in which the first differential signal line extends.

Methods are provided for manufacturing flat devices to be used for forming a shape-retaining non-flat device by deformation of the flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.