A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

An apparatus for activating a personal protection arrangement for a vehicle, including a housing, at least one circuit board, and at least one electrical or electronic component, the circuit board having at least one layer for shielding electromagnetic radiation, the circuit board being positioned in the housing in such a way that when the apparatus is mounted in the vehicle, the circuit board shields the electromagnetic radiation that is emitted by the at least one electrical or electronic component at least with respect to the interior of the vehicle. And to a method for manufacturing such an apparatus.

A high voltage power supply is disclosed. The high voltage power supply comprises a primary winding and one or more secondary windings. In one embodiment, a single secondary winding is used and the high voltage doubler circuit comprises a capacitor string and a diode string. In another embodiment, a plurality of secondary windings are used and the high voltage doubler circuit comprises a plurality of low voltage doubler circuits arranged in series. To create a more uniform distribution of voltage across the capacitors in the high voltage doubler circuit, one or more shields are disposed on the printed circuit board. In certain embodiments, a high voltage shield is disposed at the high voltage output and a low voltage shield is disposed at the low voltage end of the high voltage doubler circuit. One or more intermediate shields may be disposed in the high voltage doubler circuit.

A printed circuit board (100) includes a front layer (30) including frame ground regions (102a, 102b) on which connectors (202, 203) to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region (101) which is separated from the frame ground regions at the front layer, on which electronic devices (200, 201) configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region (103) separated from the frame ground regions (102a, 102b) and the signal ground region (101) at the front layer, situated outside the frame ground regions (102a, 102b), and connected with a ground.

A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

A device for inductively charging an electronic accessory includes a first portion, a second portion, and a spacer. The first portion includes a first transmission coil in a first plane where the first transmission coil is configured to generate a first magnetic field, and the second portion includes a first transmission coil in a second plane where the second transmission coil is configured to generate a second magnetic field. The spacer is positioned between the first transmission coil and the second transmission coil and between the first plane and the second plane. The spacer material magnetically insulates the second transmission coil from the first magnetic field.

Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

A device for inductively charging an electronic accessory includes a first portion, a second portion, and a spacer. The first portion includes a first transmission coil in a first plane where the first transmission coil is configured to generate a first magnetic field, and the second portion includes a first transmission coil in a second plane where the second transmission coil is configured to generate a second magnetic field. The spacer is positioned between the first transmission coil and the second transmission coil and between the first plane and the second plane. The spacer material magnetically insulates the second transmission coil from the first magnetic field.

To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.