Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.

An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.

A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.

According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.

A system may include a laser source, and an AOM coupled to the laser source. The AOM may include an acousto-optic medium, and transducer electrodes carried by the acousto-optic medium. The system may also include an interface board having a dielectric layer, and vertically extending signal vias within the dielectric layer. Each vertically extending signal via may have a lower end in contact with a respective transducer electrode. The interface board may have laterally extending signal traces carried by the dielectric layer. Each laterally extending signal trace may be in contact with an upper end of a respective vertically extending signal via.

An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.