The conductive composition of the present embodiment contains metal nanoparticles having an average particle diameter of 30 nm to 600 nm, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. Then, the specific resistance of the conductor formed by applying and calcining the conductive composition on the substrate is preferably 5.0×10.sup.−6 Ω.Math.cm or less, and the conductor does not peel from the substrate when a tape having an adhesive force of 3.9 N/10 mm to 39 N/10 mm is pressed against the conductor and peeled off.

An electrical contact pad for electrically contacting a connector includes first, second and third regions. The first region is connected to a trace. The second region is adjacent to the first region and has a width less than the first region. The third region is adjacent to the second region and has a width that is greater than the second region. The third region is sized to make contact with a connector. Having the width of the second region be smaller than the width of the first and third regions increases an impedance of the electrical contact pad.

A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.

To provide a substrate for a medical device and a medical device in which the reference potential of a patient circuit can be stabilized, the noise between the patient circuit and a ground-side circuit can be reduced, and the insulation distance between the patient circuit and the ground-side circuit can be sufficiently ensured without using a large-sized electronic component.

A patient circuit that is a circuit on the side of being brought into contact with or inserted into a subject, a ground-side circuit that is a circuit provided on the side of performing processing on a signal transmitted from the side of being brought into contact with or inserted into the subject and protectively grounded, an insulating layer provided between the patient circuit and the ground-side circuit and providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the surface of the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit are included.

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.

A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.

A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.

A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.